Intel Core i3-3220 vs AMD Sempron LE-1200

Comparative analysis of Intel Core i3-3220 and AMD Sempron LE-1200 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the Intel Core i3-3220

  • CPU is newer: launch date 4 year(s) 8 month(s) later
  • 1 more cores, run more applications at once: 2 vs 1
  • Around 57% higher clock speed: 3.3 GHz vs 2.1 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 65 nm
  • 3.1x better performance in PassMark - Single thread mark: 1727 vs 551
  • 6.5x better performance in PassMark - CPU mark: 2265 vs 349
  • Around 60% better performance in Geekbench 4 - Multi-Core: 1340 vs 835
Specifications (specs)
Launch date 8 April 2012 vs August 2007
Number of cores 2 vs 1
Maximum frequency 3.3 GHz vs 2.1 GHz
Manufacturing process technology 22 nm vs 65 nm
Benchmarks
PassMark - Single thread mark 1727 vs 551
PassMark - CPU mark 2265 vs 349
Geekbench 4 - Multi-Core 1340 vs 835

Reasons to consider the AMD Sempron LE-1200

  • Around 22% lower typical power consumption: 45 Watt vs 55 Watt
  • Around 39% better performance in Geekbench 4 - Single Core: 842 vs 607
Specifications (specs)
Thermal Design Power (TDP) 45 Watt vs 55 Watt
Benchmarks
Geekbench 4 - Single Core 842 vs 607

Compare benchmarks

CPU 1: Intel Core i3-3220
CPU 2: AMD Sempron LE-1200

PassMark - Single thread mark
CPU 1
CPU 2
1727
551
PassMark - CPU mark
CPU 1
CPU 2
2265
349
Geekbench 4 - Single Core
CPU 1
CPU 2
607
842
Geekbench 4 - Multi-Core
CPU 1
CPU 2
1340
835
Name Intel Core i3-3220 AMD Sempron LE-1200
PassMark - Single thread mark 1727 551
PassMark - CPU mark 2265 349
Geekbench 4 - Single Core 607 842
Geekbench 4 - Multi-Core 1340 835
3DMark Fire Strike - Physics Score 0
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 2.048
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 7.493
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.277
CompuBench 1.5 Desktop - Video Composition (Frames/s) 1.059
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 2.499
GFXBench 4.0 - T-Rex (Frames) 1527
GFXBench 4.0 - T-Rex (Fps) 1527

Compare specifications (specs)

Intel Core i3-3220 AMD Sempron LE-1200

Essentials

Architecture codename Ivy Bridge Sparta
Launch date 8 April 2012 August 2007
Launch price (MSRP) $117
Place in performance rating 2706 2700
Price now $34.90
Processor Number i3-3220
Series Legacy Intel® Core™ Processors
Status Launched
Value for money (0-100) 35.75
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 3.30 GHz
Bus Speed 5 GT/s DMI
Die size 94 mm
L1 cache 64 KB (per core) 128 KB
L2 cache 256 KB (per core) 512 KB
L3 cache 3072 KB
Manufacturing process technology 22 nm 65 nm
Maximum case temperature (TCase) 65 °C
Maximum core temperature 65.3°C
Maximum frequency 3.3 GHz 2.1 GHz
Number of cores 2 1
Number of threads 4

Memory

Max memory channels 2
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 32 GB
Supported memory types DDR3 1333/1600

Graphics

Device ID 0x152
Graphics base frequency 650 MHz
Graphics max dynamic frequency 1.05 GHz
Graphics max frequency 1.05 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel® HD Graphics 2500

Graphics interfaces

Number of displays supported 3
Wireless Display (WiDi) support

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 37.5mm
Sockets supported FCLGA1155 AM2
Thermal Design Power (TDP) 55 Watt 45 Watt
Thermal Solution 2011C

Peripherals

PCI Express revision 2.0
PCIe configurations up to 1x16, 2x8, 1x8 & 2x4

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)