Intel Core i3-330M vs Intel Pentium Dual Core T3400
Comparative analysis of Intel Core i3-330M and Intel Pentium Dual Core T3400 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s).
Differences
Reasons to consider the Intel Core i3-330M
- CPU is newer: launch date 1 year(s) 3 month(s) later
- 2 more threads: 4 vs 2
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
- Around 10% better performance in PassMark - Single thread mark: 813 vs 739
- Around 54% better performance in PassMark - CPU mark: 1020 vs 663
- Around 26% better performance in Geekbench 4 - Single Core: 317 vs 251
- Around 54% better performance in Geekbench 4 - Multi-Core: 689 vs 447
Specifications (specs) | |
Launch date | 10 January 2010 vs 1 October 2008 |
Number of threads | 4 vs 2 |
Manufacturing process technology | 32 nm vs 65 nm |
Benchmarks | |
PassMark - Single thread mark | 813 vs 739 |
PassMark - CPU mark | 1020 vs 663 |
Geekbench 4 - Single Core | 317 vs 251 |
Geekbench 4 - Multi-Core | 689 vs 447 |
Reasons to consider the Intel Pentium Dual Core T3400
- Around 1% higher clock speed: 2.16 GHz vs 2.13 GHz
- Around 11% higher maximum core temperature: 100°C vs 90°C for rPGA, 105°C for BGA
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
Maximum frequency | 2.16 GHz vs 2.13 GHz |
Maximum core temperature | 100°C vs 90°C for rPGA, 105°C for BGA |
L2 cache | 1024 KB vs 512 KB |
Compare benchmarks
CPU 1: Intel Core i3-330M
CPU 2: Intel Pentium Dual Core T3400
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core i3-330M | Intel Pentium Dual Core T3400 |
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PassMark - Single thread mark | 813 | 739 |
PassMark - CPU mark | 1020 | 663 |
Geekbench 4 - Single Core | 317 | 251 |
Geekbench 4 - Multi-Core | 689 | 447 |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 1.641 |
Compare specifications (specs)
Intel Core i3-330M | Intel Pentium Dual Core T3400 | |
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Essentials |
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Architecture codename | Arrandale | Merom |
Launch date | 10 January 2010 | 1 October 2008 |
Launch price (MSRP) | $49 | |
Place in performance rating | 2964 | 2971 |
Price now | $48.56 | |
Processor Number | i3-330M | T3400 |
Series | Legacy Intel® Core™ Processors | Legacy Intel® Pentium® Processor |
Status | Discontinued | Discontinued |
Value for money (0-100) | 10.85 | |
Vertical segment | Mobile | Mobile |
Performance |
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64 bit support | ||
Base frequency | 2.13 GHz | 2.16 GHz |
Bus Speed | 2.5 GT/s DMI | 667 MHz FSB |
Die size | 81 mm2 | 143 mm2 |
Front-side bus (FSB) | 2500 MHz | 667 MHz |
L2 cache | 512 KB | 1024 KB |
L3 cache | 3072 KB | |
Manufacturing process technology | 32 nm | 65 nm |
Maximum core temperature | 90°C for rPGA, 105°C for BGA | 100°C |
Maximum frequency | 2.13 GHz | 2.16 GHz |
Number of cores | 2 | 2 |
Number of threads | 4 | 2 |
Transistor count | 382 million | 291 million |
VID voltage range | 1.075V-1.175V | |
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 17.1 GB/s | |
Maximum memory size | 8 GB | |
Supported memory types | DDR3 800/1066 | |
Graphics |
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Graphics base frequency | 500 MHz | |
Graphics max dynamic frequency | 667 MHz | |
Graphics max frequency | 667 MHz | |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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Number of displays supported | 2 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | rPGA 37.5mmx 37.5mm, BGA 34mmx28mm | |
Sockets supported | BGA1288, PGA988 | PPGA478 |
Thermal Design Power (TDP) | 35 Watt | 35 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 2.0 | |
PCIe configurations | 1x16 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 36-bit | |
Thermal Monitoring | ||
FSB parity | ||
Intel® Demand Based Switching | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |