Intel Core i3-330M vs Intel Core 2 Duo T5870

Comparative analysis of Intel Core i3-330M and Intel Core 2 Duo T5870 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s).

Intel Core i3-330M

Intel Core 2 Duo T5870

Differences

Reasons to consider the Intel Core i3-330M

CPU is newer: launch date 1 year(s) 3 month(s) later
2 more threads: 4 vs 2
Around 7% higher clock speed: 2.13 GHz vs 2 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
Around 10% better performance in PassMark - Single thread mark: 813 vs 740
Around 46% better performance in PassMark - CPU mark: 1020 vs 698
Around 27% better performance in Geekbench 4 - Single Core: 317 vs 250
Around 61% better performance in Geekbench 4 - Multi-Core: 689 vs 429

Specifications (specs)
Launch date	10 January 2010 vs 1 October 2008
Number of threads	4 vs 2
Maximum frequency	2.13 GHz vs 2 GHz
Manufacturing process technology	32 nm vs 65 nm
Benchmarks
PassMark - Single thread mark	813 vs 740
PassMark - CPU mark	1020 vs 698
Geekbench 4 - Single Core	317 vs 250
Geekbench 4 - Multi-Core	689 vs 429

Reasons to consider the Intel Core 2 Duo T5870

Around 11% higher maximum core temperature: 100°C vs 90°C for rPGA, 105°C for BGA
4x more L2 cache, more data can be stored in the L2 cache for quick access later

Maximum core temperature	100°C vs 90°C for rPGA, 105°C for BGA
L2 cache	2048 KB vs 512 KB

Compare benchmarks

CPU 1: Intel Core i3-330M
CPU 2: Intel Core 2 Duo T5870

PassMark - Single thread mark

CPU 1

CPU 2

813

740

PassMark - CPU mark

CPU 1

CPU 2

1020

698

Geekbench 4 - Single Core

CPU 1

CPU 2

317

250

Geekbench 4 - Multi-Core

CPU 1

CPU 2

689

429

Name	Intel Core i3-330M	Intel Core 2 Duo T5870
PassMark - Single thread mark	813	740
PassMark - CPU mark	1020	698
Geekbench 4 - Single Core	317	250
Geekbench 4 - Multi-Core	689	429
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	1.641

Compare specifications (specs)

	Intel Core i3-330M	Intel Core 2 Duo T5870
Essentials
Architecture codename	Arrandale	Merom
Launch date	10 January 2010	1 October 2008
Launch price (MSRP)	$49
Place in performance rating	2964	2970
Price now	$48.56
Processor Number	i3-330M	T5870
Series	Legacy Intel® Core™ Processors	Legacy Intel® Core™ Processors
Status	Discontinued	Discontinued
Value for money (0-100)	10.85
Vertical segment	Mobile	Mobile
Performance
64 bit support
Base frequency	2.13 GHz	2.00 GHz
Bus Speed	2.5 GT/s DMI	800 MHz FSB
Die size	81 mm2	143 mm2
Front-side bus (FSB)	2500 MHz	800 MHz
L2 cache	512 KB	2048 KB
L3 cache	3072 KB
Manufacturing process technology	32 nm	65 nm
Maximum core temperature	90°C for rPGA, 105°C for BGA	100°C
Maximum frequency	2.13 GHz	2 GHz
Number of cores	2	2
Number of threads	4	2
Transistor count	382 million	291 million
VID voltage range		1.075V-1.175V
Memory
Max memory channels	2
Maximum memory bandwidth	17.1 GB/s
Maximum memory size	8 GB
Supported memory types	DDR3 800/1066
Graphics
Graphics base frequency	500 MHz
Graphics max dynamic frequency	667 MHz
Graphics max frequency	667 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Processor graphics	Intel HD Graphics
Graphics interfaces
Number of displays supported	2
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	rPGA 37.5mmx 37.5mm, BGA 34mmx28mm	35mm x 35mm
Sockets supported	BGA1288, PGA988
Thermal Design Power (TDP)	35 Watt	35 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)	36-bit
Thermal Monitoring
FSB parity
Intel® Demand Based Switching
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)