Intel Core i3-4170 vs AMD Phenom II X2 B57

Comparative analysis of Intel Core i3-4170 and AMD Phenom II X2 B57 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).

Intel Core i3-4170

AMD Phenom II X2 B57

Differences

Reasons to consider the Intel Core i3-4170

2 more threads: 4 vs 2
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
Around 48% lower typical power consumption: 54 Watt vs 80 Watt
Around 62% better performance in PassMark - Single thread mark: 2060 vs 1273
2.9x better performance in PassMark - CPU mark: 3595 vs 1247

Specifications (specs)
Number of threads	4 vs 2
Manufacturing process technology	22 nm vs 45 nm
Thermal Design Power (TDP)	54 Watt vs 80 Watt
Benchmarks
PassMark - Single thread mark	2060 vs 1273
PassMark - CPU mark	3595 vs 1247

Compare benchmarks

CPU 1: Intel Core i3-4170
CPU 2: AMD Phenom II X2 B57

PassMark - Single thread mark

CPU 1

CPU 2

2060

1273

PassMark - CPU mark

CPU 1

CPU 2

3595

1247

Name	Intel Core i3-4170	AMD Phenom II X2 B57
PassMark - Single thread mark	2060	1273
PassMark - CPU mark	3595	1247
Geekbench 4 - Single Core	823
Geekbench 4 - Multi-Core	1743
3DMark Fire Strike - Physics Score	0
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	2.614
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	46.136
CompuBench 1.5 Desktop - T-Rex (Frames/s)	0.297
CompuBench 1.5 Desktop - Video Composition (Frames/s)	1.273
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)	3.137
GFXBench 4.0 - Car Chase Offscreen (Frames)	870
GFXBench 4.0 - Manhattan (Frames)	2169
GFXBench 4.0 - T-Rex (Frames)	3711
GFXBench 4.0 - Car Chase Offscreen (Fps)	870
GFXBench 4.0 - Manhattan (Fps)	2169
GFXBench 4.0 - T-Rex (Fps)	3711

Compare specifications (specs)

	Intel Core i3-4170	AMD Phenom II X2 B57
Essentials
Architecture codename	Haswell	Callisto
Launch date	Q1'15	May 2010
Place in performance rating	1867	1886
Processor Number	i3-4170
Series	4th Generation Intel® Core™ i3 Processors	AMD Business Class - AMD Phenom X2 Dual-Core
Status	Discontinued
Vertical segment	Desktop	Desktop
Family		AMD Phenom
OPN Tray		HDXB57WFK2DGM
Performance
64 bit support
Base frequency	3.70 GHz	3.2 GHz
Bus Speed	5 GT/s DMI2
Manufacturing process technology	22 nm	45 nm
Maximum core temperature	72°C
Number of cores	2	2
Number of threads	4	2
Die size		258 mm
L1 cache		128 KB (per core)
L2 cache		512 KB (per core)
L3 cache		6144 KB (shared)
Maximum frequency		3.2 GHz
Transistor count		758 million
Unlocked
Memory
Max memory channels	2
Maximum memory bandwidth	25.6 GB/s
Maximum memory size	32 GB
Supported memory types	DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V	DDR3
Graphics
Device ID	0x41E
Graphics base frequency	350 MHz
Graphics max dynamic frequency	1.15 GHz
Intel® Clear Video HD technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory	2 GB
Processor graphics	Intel® HD Graphics 4400
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported	3
VGA
Graphics image quality
Max resolution over DisplayPort	3840x2160@60Hz
Max resolution over eDP	3840x2160@60Hz
Max resolution over HDMI 1.4	4096x2304@24Hz
Max resolution over VGA	1920x1200@60Hz
Graphics API support
DirectX	11.1/12
OpenGL	4.3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm
Sockets supported	FCLGA1150	AM3
Thermal Design Power (TDP)	54 Watt	80 Watt
Thermal Solution	PCG 2013C
Peripherals
Max number of PCIe lanes	16
PCI Express revision	Up to 3.0
PCIe configurations	Up to 1x16, 2x8, 1x8+2x4
Scalability	1S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)