Intel Core i3-530 vs AMD Sempron LE-1150

Comparative analysis of Intel Core i3-530 and AMD Sempron LE-1150 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

Intel Core i3-530

AMD Sempron LE-1150

Differences

Reasons to consider the Intel Core i3-530

CPU is newer: launch date 2 year(s) 5 month(s) later
1 more cores, run more applications at once: 2 vs 1
Around 47% higher clock speed: 2.93 GHz vs 2 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
2x more L2 cache, more data can be stored in the L2 cache for quick access later
2.4x better performance in PassMark - Single thread mark: 1164 vs 477
6x better performance in PassMark - CPU mark: 1504 vs 251
Around 36% better performance in Geekbench 4 - Multi-Core: 976 vs 719

Specifications (specs)
Launch date	January 2010 vs August 2007
Number of cores	2 vs 1
Maximum frequency	2.93 GHz vs 2 GHz
Manufacturing process technology	32 nm vs 65 nm
L2 cache	256 KB (per core) vs 256 KB
Benchmarks
PassMark - Single thread mark	1164 vs 477
PassMark - CPU mark	1504 vs 251
Geekbench 4 - Multi-Core	976 vs 719

Reasons to consider the AMD Sempron LE-1150

Around 62% lower typical power consumption: 45 Watt vs 73 Watt
Around 70% better performance in Geekbench 4 - Single Core: 740 vs 436

Specifications (specs)
Thermal Design Power (TDP)	45 Watt vs 73 Watt
Benchmarks
Geekbench 4 - Single Core	740 vs 436

Compare benchmarks

CPU 1: Intel Core i3-530
CPU 2: AMD Sempron LE-1150

PassMark - Single thread mark

CPU 1

CPU 2

1164

477

PassMark - CPU mark

CPU 1

CPU 2

1504

251

Geekbench 4 - Single Core

CPU 1

CPU 2

436

740

Geekbench 4 - Multi-Core

CPU 1

CPU 2

976

719

Name	Intel Core i3-530	AMD Sempron LE-1150
PassMark - Single thread mark	1164	477
PassMark - CPU mark	1504	251
Geekbench 4 - Single Core	436	740
Geekbench 4 - Multi-Core	976	719
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	6.826
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	41.225
CompuBench 1.5 Desktop - T-Rex (Frames/s)	0.318
CompuBench 1.5 Desktop - Video Composition (Frames/s)	0.183
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)	7.893

Compare specifications (specs)

	Intel Core i3-530	AMD Sempron LE-1150
Essentials
Architecture codename	Clarkdale	Sparta
Launch date	January 2010	August 2007
Launch price (MSRP)	$60
Place in performance rating	2809	2820
Price now	$20
Processor Number	i3-530
Series	Legacy Intel® Core™ Processors
Status	Discontinued
Value for money (0-100)	37.80
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	2.93 GHz
Bus Speed	2.5 GT/s DMI
Die size	81 mm2
L1 cache	64 KB (per core)	128 KB
L2 cache	256 KB (per core)	256 KB
L3 cache	4096 KB (shared)
Manufacturing process technology	32 nm	65 nm
Maximum core temperature	72.6°C
Maximum frequency	2.93 GHz	2 GHz
Number of cores	2	1
Number of threads	4
Transistor count	382 million
VID voltage range	0.6500V-1.4000V
Memory
Max memory channels	2
Maximum memory bandwidth	21 GB/s
Maximum memory size	16.38 GB
Supported memory types	DDR3 1066/1333
Graphics
Graphics base frequency	733 MHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Processor graphics	Intel HD Graphics
Graphics interfaces
Number of displays supported	2
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm
Sockets supported	FCLGA1156	AM2
Thermal Design Power (TDP)	73 Watt	45 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)	36-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® VT-x with Extended Page Tables (EPT)