Intel Core i3-6100 vs AMD Phenom II X3 B75
Comparative analysis of Intel Core i3-6100 and AMD Phenom II X3 B75 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i3-6100
- CPU is newer: launch date 5 year(s) 11 month(s) later
- 1 more threads: 4 vs 3
- Around 23% higher clock speed: 3.7 GHz vs 3 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 45 nm
- Around 86% lower typical power consumption: 51 Watt vs 95 Watt
- Around 74% better performance in PassMark - Single thread mark: 2181 vs 1256
- 2.3x better performance in PassMark - CPU mark: 4136 vs 1781
| Specifications (specs) | |
| Launch date | September 2015 vs October 2009 |
| Number of threads | 4 vs 3 |
| Maximum frequency | 3.7 GHz vs 3 GHz |
| Manufacturing process technology | 14 nm vs 45 nm |
| Thermal Design Power (TDP) | 51 Watt vs 95 Watt |
| Benchmarks | |
| PassMark - Single thread mark | 2181 vs 1256 |
| PassMark - CPU mark | 4136 vs 1781 |
Reasons to consider the AMD Phenom II X3 B75
- 1 more cores, run more applications at once: 3 vs 2
- 3x more L1 cache, more data can be stored in the L1 cache for quick access later
- 3x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
- 2.1x better performance in Geekbench 4 - Single Core: 1905 vs 906
- 2.2x better performance in Geekbench 4 - Multi-Core: 4439 vs 1976
| Specifications (specs) | |
| Number of cores | 3 vs 2 |
| L1 cache | 128 KB (per core) vs 64 KB (per core) |
| L2 cache | 512 KB (per core) vs 256 KB (per core) |
| L3 cache | 6144 KB (shared) vs 4096 KB (shared) |
| Benchmarks | |
| Geekbench 4 - Single Core | 1905 vs 906 |
| Geekbench 4 - Multi-Core | 4439 vs 1976 |
Compare benchmarks
CPU 1: Intel Core i3-6100
CPU 2: AMD Phenom II X3 B75
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| Name | Intel Core i3-6100 | AMD Phenom II X3 B75 |
|---|---|---|
| PassMark - Single thread mark | 2181 | 1256 |
| PassMark - CPU mark | 4136 | 1781 |
| Geekbench 4 - Single Core | 906 | 1905 |
| Geekbench 4 - Multi-Core | 1976 | 4439 |
| 3DMark Fire Strike - Physics Score | 2197 | |
| CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 2.581 | |
| CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 47.944 | |
| CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.3 | |
| CompuBench 1.5 Desktop - Video Composition (Frames/s) | 1.387 | |
| CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 3.445 | |
| GFXBench 4.0 - Car Chase Offscreen (Frames) | 1558 | |
| GFXBench 4.0 - Manhattan (Frames) | 3264 | |
| GFXBench 4.0 - T-Rex (Frames) | 5567 | |
| GFXBench 4.0 - Car Chase Offscreen (Fps) | 1558 | |
| GFXBench 4.0 - Manhattan (Fps) | 3264 | |
| GFXBench 4.0 - T-Rex (Fps) | 5567 |
Compare specifications (specs)
| Intel Core i3-6100 | AMD Phenom II X3 B75 | |
|---|---|---|
Essentials |
||
| Architecture codename | Skylake | Heka |
| Launch date | September 2015 | October 2009 |
| Launch price (MSRP) | $110 | |
| Place in performance rating | 1456 | 1502 |
| Price now | $147.49 | $39.99 |
| Processor Number | i3-6100 | |
| Series | 6th Generation Intel® Core™ i3 Processors | AMD Business Class - AMD Phenom X3 Triple-Core |
| Status | Launched | |
| Value for money (0-100) | 10.96 | 21.61 |
| Vertical segment | Desktop | Desktop |
| Family | AMD Phenom | |
| OPN Tray | HDXB75WFK3DGM | |
Performance |
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| 64 bit support | ||
| Base frequency | 3.70 GHz | 3 GHz |
| Bus Speed | 8 GT/s DMI3 | |
| Die size | 150 mm | 258 mm |
| L1 cache | 64 KB (per core) | 128 KB (per core) |
| L2 cache | 256 KB (per core) | 512 KB (per core) |
| L3 cache | 4096 KB (shared) | 6144 KB (shared) |
| Manufacturing process technology | 14 nm | 45 nm |
| Maximum case temperature (TCase) | 65 °C | |
| Maximum core temperature | 65°C | |
| Maximum frequency | 3.7 GHz | 3 GHz |
| Number of cores | 2 | 3 |
| Number of threads | 4 | 3 |
| Transistor count | 1400 million | 758 million |
| Unlocked | ||
Memory |
||
| ECC memory support | ||
| Max memory channels | 2 | |
| Maximum memory bandwidth | 34.1 GB/s | |
| Maximum memory size | 64 GB | |
| Supported memory types | DDR4-1866/2133, DDR3L-1333/1600 @ 1.35V | DDR3 |
Graphics |
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| Device ID | 0x1912 | |
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 1.05 GHz | |
| Graphics max frequency | 1.05 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 64 GB | |
| Processor graphics | Intel® HD Graphics 530 | |
Graphics interfaces |
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| DisplayPort | ||
| DVI | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | |
| Wireless Display (WiDi) support | ||
Graphics image quality |
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| 4K resolution support | ||
| Max resolution over DisplayPort | 4096x2304@60Hz | |
| Max resolution over eDP | 4096x2304@60Hz | |
| Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
| Max resolution over VGA | N / A | |
| Max resolution over WiDi | 1080p | |
Graphics API support |
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| DirectX | 12 | |
| OpenGL | 4.5 | |
Compatibility |
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| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 37.5mm x 37.5mm | |
| Sockets supported | FCLGA1151 | AM3 |
| Thermal Design Power (TDP) | 51 Watt | 95 Watt |
| Thermal Solution | PCG 2015C (65W) | |
Peripherals |
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| Max number of PCIe lanes | 16 | |
| PCI Express revision | 3.0 | |
| PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
| Scalability | 1S Only | |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Memory Protection Extensions (Intel® MPX) | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
| Intel 64 | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® TSX-NI | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
| Thermal Monitoring | ||
Virtualization |
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| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
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