Intel Core i5-3350P vs Intel Core i5-670

Comparative analysis of Intel Core i5-3350P and Intel Core i5-670 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score.

 

Differences

Reasons to consider the Intel Core i5-3350P

  • CPU is newer: launch date 2 year(s) 7 month(s) later
  • 2 more cores, run more applications at once: 4 vs 2
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
  • 2x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
  • Around 94% higher maximum memory size: 32.23 GB vs 16.6 GB
  • Around 6% lower typical power consumption: 69 Watt vs 73 Watt
  • Around 17% better performance in PassMark - Single thread mark: 1793 vs 1530
  • Around 69% better performance in PassMark - CPU mark: 4280 vs 2533
  • Around 25% better performance in Geekbench 4 - Single Core: 675 vs 538
  • Around 78% better performance in Geekbench 4 - Multi-Core: 2230 vs 1252
Specifications (specs)
Launch date September 2012 vs January 2010
Number of cores 4 vs 2
Manufacturing process technology 22 nm vs 32 nm
L1 cache 64 KB (per core) vs 64 KB (per core)
L2 cache 256 KB (per core) vs 256 KB (per core)
L3 cache 6144 KB (shared) vs 4096 KB (shared)
Maximum memory size 32.23 GB vs 16.6 GB
Thermal Design Power (TDP) 69 Watt vs 73 Watt
Benchmarks
PassMark - Single thread mark 1793 vs 1530
PassMark - CPU mark 4280 vs 2533
Geekbench 4 - Single Core 675 vs 538
Geekbench 4 - Multi-Core 2230 vs 1252

Reasons to consider the Intel Core i5-670

  • Around 13% higher clock speed: 3.73 GHz vs 3.30 GHz
  • Around 8% higher maximum core temperature: 72.6°C vs 67.4°C
Maximum frequency 3.73 GHz vs 3.30 GHz
Maximum core temperature 72.6°C vs 67.4°C

Compare benchmarks

CPU 1: Intel Core i5-3350P
CPU 2: Intel Core i5-670

PassMark - Single thread mark
CPU 1
CPU 2
1793
1530
PassMark - CPU mark
CPU 1
CPU 2
4280
2533
Geekbench 4 - Single Core
CPU 1
CPU 2
675
538
Geekbench 4 - Multi-Core
CPU 1
CPU 2
2230
1252
Name Intel Core i5-3350P Intel Core i5-670
PassMark - Single thread mark 1793 1530
PassMark - CPU mark 4280 2533
Geekbench 4 - Single Core 675 538
Geekbench 4 - Multi-Core 2230 1252
3DMark Fire Strike - Physics Score 0

Compare specifications (specs)

Intel Core i5-3350P Intel Core i5-670

Essentials

Architecture codename Ivy Bridge Clarkdale
Launch date September 2012 January 2010
Launch price (MSRP) $292 $252
Place in performance rating 2092 2098
Price now $169.99 $89.99
Processor Number i5-3350P i5-670
Series Legacy Intel® Core™ Processors Legacy Intel® Core™ Processors
Status Discontinued Discontinued
Value for money (0-100) 10.64 10.84
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 3.10 GHz 3.46 GHz
Bus Speed 5 GT/s DMI 2.5 GT/s DMI
Die size 133 mm 81 mm2
L1 cache 64 KB (per core) 64 KB (per core)
L2 cache 256 KB (per core) 256 KB (per core)
L3 cache 6144 KB (shared) 4096 KB (shared)
Manufacturing process technology 22 nm 32 nm
Maximum case temperature (TCase) 65 °C
Maximum core temperature 67.4°C 72.6°C
Maximum frequency 3.30 GHz 3.73 GHz
Number of cores 4 2
Number of threads 4 4
Transistor count 382 million
VID voltage range 0.6500V-1.4000V

Memory

Max memory channels 2 2
Maximum memory bandwidth 25.6 GB/s 21 GB/s
Maximum memory size 32.23 GB 16.6 GB
Supported memory types DDR3 1333/1600 DDR3 1066/1333

Graphics

Processor graphics None Intel HD Graphics
Graphics base frequency 733 MHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 37.5mm 37.5mm x 37.5mm
Sockets supported FCLGA1155 FCLGA1156
Thermal Design Power (TDP) 69 Watt 73 Watt

Peripherals

PCI Express revision 3.0 2.0
PCIe configurations up to 1x16, 2x8, 1x8 & 2x4 1x16, 2x8
Max number of PCIe lanes 16

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX Intel® SSE4.2
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Flexible Display interface (FDI)
Intel® Demand Based Switching
Physical Address Extensions (PAE) 36-bit

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)

Graphics interfaces

Number of displays supported 2