Intel Core i5-6442EQ vs Intel Core i7-4770TE
Comparative analysis of Intel Core i5-6442EQ and Intel Core i7-4770TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Core i5-6442EQ
- Around 40% higher maximum core temperature: 100°C vs 71.45°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- 2x more maximum memory size: 64 GB vs 32 GB
- Around 80% lower typical power consumption: 25 Watt vs 45 Watt
Maximum core temperature | 100°C vs 71.45°C |
Manufacturing process technology | 14 nm vs 22 nm |
Maximum memory size | 64 GB vs 32 GB |
Thermal Design Power (TDP) | 25 Watt vs 45 Watt |
Reasons to consider the Intel Core i7-4770TE
- 4 more threads: 8 vs 4
- Around 22% higher clock speed: 3.30 GHz vs 2.70 GHz
- Around 9% better performance in PassMark - CPU mark: 4877 vs 4487
Specifications (specs) | |
Number of threads | 8 vs 4 |
Maximum frequency | 3.30 GHz vs 2.70 GHz |
Benchmarks | |
PassMark - Single thread mark | 1653 vs 1649 |
PassMark - CPU mark | 4877 vs 4487 |
Compare benchmarks
CPU 1: Intel Core i5-6442EQ
CPU 2: Intel Core i7-4770TE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i5-6442EQ | Intel Core i7-4770TE |
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PassMark - Single thread mark | 1649 | 1653 |
PassMark - CPU mark | 4487 | 4877 |
Compare specifications (specs)
Intel Core i5-6442EQ | Intel Core i7-4770TE | |
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Essentials |
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Architecture codename | Skylake | Haswell |
Launch date | Q4'15 | June 2013 |
Place in performance rating | 1516 | 1514 |
Processor Number | i5-6442EQ | i7-4770TE |
Series | 6th Generation Intel® Core™ i5 Processors | 4th Generation Intel® Core™ i7 Processors |
Status | Launched | Launched |
Vertical segment | Embedded | Embedded |
Performance |
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64 bit support | ||
Base frequency | 1.90 GHz | 2.30 GHz |
Bus Speed | 8 GT/s DMI3 | 5 GT/s DMI |
Manufacturing process technology | 14 nm | 22 nm |
Maximum core temperature | 100°C | 71.45°C |
Maximum frequency | 2.70 GHz | 3.30 GHz |
Number of cores | 4 | 4 |
Number of threads | 4 | 8 |
Die size | 177 mm | |
L1 cache | 64 KB (per core) | |
L2 cache | 256 KB (per core) | |
L3 cache | 8192 KB (shared) | |
Maximum case temperature (TCase) | 71 °C | |
Transistor count | 1400 million | |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 34.1 GB/s | 25.6 GB/s |
Maximum memory size | 64 GB | 32 GB |
Supported memory types | DDR4-2133, LPDDR3-1866, DDR3L-1600 | DDR3 1333/1600 |
Graphics |
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Device ID | 0x191B | |
Graphics base frequency | 350 MHz | 350 MHz |
Graphics max dynamic frequency | 1.00 GHz | 1.00 GHz |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 64 GB | 2 GB |
Processor graphics | Intel® HD Graphics 530 | Intel® HD Graphics 4600 |
Graphics max frequency | 1 GHz | |
Intel® Flexible Display Interface (Intel® FDI) | ||
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | 3 |
VGA | ||
Wireless Display (WiDi) support | ||
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | N / A |
Graphics API support |
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DirectX | 12 | 11.2/12 |
OpenGL | 4.5 | 4.3 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 42mm x 28mm | 37.5mm x 37.5mm (LGA1150) |
Sockets supported | FCBGA1440 | FCLGA1150 |
Thermal Design Power (TDP) | 25 Watt | 45 Watt |
Thermal Solution | PCG 2013B | |
Peripherals |
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Max number of PCIe lanes | 16 | 16 |
PCI Express revision | 3.0 | 3.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | 1x16 |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Anti-Theft technology | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Flexible Display interface (FDI) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |