Intel Core i7-11700 vs AMD Ryzen 9 PRO 3900
Comparative analysis of Intel Core i7-11700 and AMD Ryzen 9 PRO 3900 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the Intel Core i7-11700
- CPU is newer: launch date 1 year(s) 5 month(s) later
- Around 14% higher clock speed: 4.90 GHz vs 4.3 GHz
- Around 5% higher maximum core temperature: 100°C vs 95 °C
- Around 16% better performance in PassMark - Single thread mark: 3118 vs 2692
| Specifications (specs) | |
| Launch date | 16 Mar 2021 vs 30 Sep 2019 |
| Maximum frequency | 4.90 GHz vs 4.3 GHz |
| Maximum core temperature | 100°C vs 95 °C |
| Benchmarks | |
| PassMark - Single thread mark | 3118 vs 2692 |
Reasons to consider the AMD Ryzen 9 PRO 3900
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- 4 more cores, run more applications at once: 12 vs 8
- 8 more threads: 24 vs 16
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 7 nm vs 14 nm
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- 3x more L2 cache, more data can be stored in the L2 cache for quick access later
- Around 60% better performance in PassMark - CPU mark: 31609 vs 19796
- Around 4% better performance in 3DMark Fire Strike - Physics Score: 8013 vs 7705
| Specifications (specs) | |
| Unlocked | Unlocked vs Locked |
| Number of cores | 12 vs 8 |
| Number of threads | 24 vs 16 |
| Manufacturing process technology | 7 nm vs 14 nm |
| L1 cache | 768 KB vs 512 KB |
| L2 cache | 6 MB vs 2 MB |
| Benchmarks | |
| PassMark - CPU mark | 31609 vs 19796 |
| 3DMark Fire Strike - Physics Score | 8013 vs 7705 |
Compare benchmarks
CPU 1: Intel Core i7-11700
CPU 2: AMD Ryzen 9 PRO 3900
| PassMark - Single thread mark |
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| PassMark - CPU mark |
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| 3DMark Fire Strike - Physics Score |
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| Name | Intel Core i7-11700 | AMD Ryzen 9 PRO 3900 |
|---|---|---|
| PassMark - Single thread mark | 3118 | 2692 |
| PassMark - CPU mark | 19796 | 31609 |
| 3DMark Fire Strike - Physics Score | 7705 | 8013 |
Compare specifications (specs)
| Intel Core i7-11700 | AMD Ryzen 9 PRO 3900 | |
|---|---|---|
Essentials |
||
| Architecture codename | Rocket Lake | Zen 2 |
| Launch date | 16 Mar 2021 | 30 Sep 2019 |
| Launch price (MSRP) | $323 - $333 | |
| Place in performance rating | 669 | 678 |
| Processor Number | i7-11700 | PRO 3900 |
| Series | 11th Generation Intel Core i7 Processors | |
| Status | Launched | |
| Vertical segment | Desktop | Desktop |
| Family | Ryzen 9 | |
| OPN Tray | 100-000000072 | |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.50 GHz | 3.1 GHz |
| Bus Speed | 8 GT/s | |
| Front-side bus (FSB) | 16 MB | |
| L1 cache | 512 KB | 768 KB |
| L2 cache | 2 MB | 6 MB |
| Manufacturing process technology | 14 nm | 7 nm |
| Maximum core temperature | 100°C | 95 °C |
| Maximum frequency | 4.90 GHz | 4.3 GHz |
| Number of cores | 8 | 12 |
| Number of threads | 16 | 24 |
| L3 cache | 64 MB | |
| Unlocked | ||
Memory |
||
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 50 GB/s | 47.68 GB/s |
| Maximum memory size | 128 GB | 128 GB |
| Supported memory types | DDR4-3200 | DDR4-3200 |
Graphics |
||
| Device ID | 0x4C8A | |
| Execution Units | 32 | |
| Graphics base frequency | 350 MHz | |
| Graphics max dynamic frequency | 1.30 GHz | |
| Intel® Clear Video HD technology | ||
| Intel® Clear Video technology | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 64 GB | |
| Processor graphics | Intel UHD Graphics 750 | |
Graphics interfaces |
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| Number of displays supported | 3 | |
Graphics image quality |
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| 4K resolution support | ||
| Max resolution over DisplayPort | 5120 x 3200 @60Hz | |
| Max resolution over eDP | 5120 x 3200 @60Hz | |
Graphics API support |
||
| DirectX | 12.1 | |
| OpenGL | 4.5 | |
Compatibility |
||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 37.5 mm x 37.5 mm | |
| Sockets supported | FCLGA1200 | AM4 |
| Thermal Design Power (TDP) | 65 Watt | 65 Watt |
| Thermal Solution | PCG 2019C | |
Peripherals |
||
| Max number of PCIe lanes | 20 | 20 |
| PCI Express revision | 4.0 | 4.0 |
| PCIe configurations | Up to 1x16+1x4, 2x8+1x4, 1x8+3x4 | 1x16+x4, 2x8+x4, 1x8+2x4+x4 |
| Scalability | 1S Only | |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® OS Guard | ||
| Intel® Secure Key technology | ||
| Intel® Software Guard Extensions (Intel® SGX) | ||
| Intel® Trusted Execution technology (TXT) | ||
| Secure Boot | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2, Intel AVX-512 | |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® Optane™ Memory Supported | ||
| Intel® Stable Image Platform Program (SIPP) | ||
| Intel® Thermal Velocity Boost | ||
| Intel® Turbo Boost technology | ||
| Thermal Monitoring | ||
| AMD SenseMI | ||
| Fused Multiply-Add 3 (FMA3) | ||
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® Advanced Vector Extensions 2 (AVX2) | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||
| AMD Virtualization (AMD-V™) | ||
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