Intel Core i7-2610UE vs Intel Core 2 Extreme X7800

Comparative analysis of Intel Core i7-2610UE and Intel Core 2 Extreme X7800 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Core i7-2610UE

  • 2 more threads: 4 vs 2
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 65 nm
  • 2.6x lower typical power consumption: 17 Watt vs 44 Watt
  • Around 34% better performance in PassMark - CPU mark: 1527 vs 1138
Specifications (specs)
Number of threads 4 vs 2
Manufacturing process technology 32 nm vs 65 nm
Thermal Design Power (TDP) 17 Watt vs 44 Watt
Benchmarks
PassMark - CPU mark 1527 vs 1138

Reasons to consider the Intel Core 2 Extreme X7800

  • Around 8% higher clock speed: 2.6 GHz vs 2.40 GHz
  • Around 2% better performance in PassMark - Single thread mark: 1077 vs 1051
Specifications (specs)
Maximum frequency 2.6 GHz vs 2.40 GHz
Benchmarks
PassMark - Single thread mark 1077 vs 1051

Compare benchmarks

CPU 1: Intel Core i7-2610UE
CPU 2: Intel Core 2 Extreme X7800

PassMark - Single thread mark
CPU 1
CPU 2
1051
1077
PassMark - CPU mark
CPU 1
CPU 2
1527
1138
Name Intel Core i7-2610UE Intel Core 2 Extreme X7800
PassMark - Single thread mark 1051 1077
PassMark - CPU mark 1527 1138

Compare specifications (specs)

Intel Core i7-2610UE Intel Core 2 Extreme X7800

Essentials

Architecture codename Sandy Bridge Merom
Launch date Q1'11 17 July 2007
Place in performance rating 2216 2211
Processor Number i7-2610UE X7800
Series Legacy Intel® Core™ Processors Legacy Intel® Core™ Processors
Status Launched Discontinued
Vertical segment Embedded Mobile
Launch price (MSRP) $851

Performance

64 bit support
Base frequency 1.50 GHz 2.60 GHz
Bus Speed 5 GT/s DMI 800 MHz FSB
Manufacturing process technology 32 nm 65 nm
Maximum core temperature 100 C 100°C
Maximum frequency 2.40 GHz 2.6 GHz
Number of cores 2 2
Number of threads 4 2
Die size 143 mm2
Front-side bus (FSB) 800 MHz
L1 cache 128 KB
L2 cache 4096 KB
Transistor count 291 million
VID voltage range 1.100V-1.375V

Memory

Max memory channels 2
Maximum memory size 16.6 GB
Supported memory types DDR3 1066/1333

Graphics

Graphics base frequency 350 MHz
Graphics max dynamic frequency 850 MHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel® HD Graphics 3000

Graphics interfaces

CRT
DisplayPort
eDP
HDMI
Number of displays supported 2
SDVO

Compatibility

Low Halogen Options Available
Package Size 31mm x 24mm (FCBGA1023) 35mm x 35mm
Sockets supported FCBGA1023 PPGA478
Thermal Design Power (TDP) 17 Watt 44 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16, 2x8, 1x8+2x4

Security & Reliability

Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)
Execute Disable Bit (EDB)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
FSB parity

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)