Intel Core i7-2657M vs AMD Phenom II X2 N660

Comparative analysis of Intel Core i7-2657M and AMD Phenom II X2 N660 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Core i7-2657M

AMD Phenom II X2 N660

Differences

Reasons to consider the Intel Core i7-2657M

2 more threads: 4 vs 2
A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
2.1x lower typical power consumption: 17 Watt vs 35 Watt

Number of threads	4 vs 2
Manufacturing process technology	32 nm vs 45 nm
Thermal Design Power (TDP)	17 Watt vs 35 Watt

Reasons to consider the AMD Phenom II X2 N660

Around 11% higher clock speed: 3 GHz vs 2.70 GHz
2x more L1 cache, more data can be stored in the L1 cache for quick access later
4x more L2 cache, more data can be stored in the L2 cache for quick access later

Maximum frequency	3 GHz vs 2.70 GHz
L1 cache	256 KB vs 128 KB
L2 cache	2 MB vs 512 KB

Compare benchmarks

CPU 1: Intel Core i7-2657M
CPU 2: AMD Phenom II X2 N660

Name	Intel Core i7-2657M	AMD Phenom II X2 N660
PassMark - Single thread mark		1093
PassMark - CPU mark		1083
Geekbench 4 - Single Core		264
Geekbench 4 - Multi-Core		444

Compare specifications (specs)

	Intel Core i7-2657M	AMD Phenom II X2 N660
Essentials
Architecture codename	Sandy Bridge	Champlain
Launch date	3 January 2011	1 January 2011
Launch price (MSRP)	$317
Place in performance rating	not rated	2710
Processor Number	i7-2657M
Series	Legacy Intel® Core™ Processors	AMD Phenom II Dual-Core Mobile Processors
Status	Launched
Vertical segment	Mobile	Laptop
Family		AMD Phenom
OPN Tray		HMN660DCR23GM
Performance
64 bit support
Base frequency	1.60 GHz	3 GHz
Bus Speed	5 GT/s DMI
Die size	149 mm
L1 cache	128 KB	256 KB
L2 cache	512 KB	2 MB
L3 cache	4096 KB
Manufacturing process technology	32 nm	45 nm
Maximum core temperature	100 C	100°C
Maximum frequency	2.70 GHz	3 GHz
Number of cores	2	2
Number of threads	4	2
Transistor count	624 Million
Front-side bus (FSB)		3600 MHz
Unlocked
Memory
Max memory channels	2
Maximum memory bandwidth	21.3 GB/s
Maximum memory size	8.01 GB
Supported memory types	DDR3 1066/1333	DDR3
Graphics
Device ID	0x116
Graphics base frequency	350 MHz
Graphics max dynamic frequency	1.00 GHz
Graphics max frequency	1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel® HD Graphics 3000
Graphics interfaces
CRT
DisplayPort
eDP
HDMI
Number of displays supported	2
SDVO
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1
Package Size	31.0mm x 24.0mm (BGA1023)
Sockets supported	FCBGA1023	S1
Thermal Design Power (TDP)	17 Watt	35 Watt
Peripherals
Max number of PCIe lanes	16
PCI Express revision	2.0
PCIe configurations	1x16, 2x8, 1x8+2x4
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
4G WiMAX Wireless
Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions	Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
VirusProtect
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)