Intel Core i7-2700K vs AMD Sempron 130

Comparative analysis of Intel Core i7-2700K and AMD Sempron 130 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

 

Differences

Reasons to consider the Intel Core i7-2700K

  • CPU is newer: launch date 1 month(s) later
  • Processor is unlocked, an unlocked multiplier allows for easier overclocking
  • 3 more cores, run more applications at once: 4 vs 1
  • Around 50% higher clock speed: 3.90 GHz vs 2.6 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
  • 2x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 72% better performance in PassMark - Single thread mark: 1825 vs 1059
  • 11.2x better performance in PassMark - CPU mark: 5744 vs 511
Specifications (specs)
Launch date October 2011 vs August 2011
Unlocked Unlocked vs Locked
Number of cores 4 vs 1
Maximum frequency 3.90 GHz vs 2.6 GHz
Manufacturing process technology 32 nm vs 45 nm
L1 cache 64 KB (per core) vs 128 KB (per core)
L2 cache 256 KB (per core) vs 512 KB (per core)
Benchmarks
PassMark - Single thread mark 1825 vs 1059
PassMark - CPU mark 5744 vs 511

Reasons to consider the AMD Sempron 130

  • 2.1x lower typical power consumption: 45 Watt vs 95 Watt
Thermal Design Power (TDP) 45 Watt vs 95 Watt

Compare benchmarks

CPU 1: Intel Core i7-2700K
CPU 2: AMD Sempron 130

PassMark - Single thread mark
CPU 1
CPU 2
1825
1059
PassMark - CPU mark
CPU 1
CPU 2
5744
511
Name Intel Core i7-2700K AMD Sempron 130
PassMark - Single thread mark 1825 1059
PassMark - CPU mark 5744 511
Geekbench 4 - Single Core 846
Geekbench 4 - Multi-Core 3277
3DMark Fire Strike - Physics Score 3461
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 4.472
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 66.305
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.557
CompuBench 1.5 Desktop - Video Composition (Frames/s) 1.632
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 4.935

Compare specifications (specs)

Intel Core i7-2700K AMD Sempron 130

Essentials

Architecture codename Sandy Bridge Sargas
Launch date October 2011 August 2011
Launch price (MSRP) $514 $25
Place in performance rating 2243 2251
Price now $288.99 $24.99
Processor Number i7-2700K
Series Legacy Intel® Core™ Processors
Status Discontinued
Value for money (0-100) 8.88 7.73
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 3.50 GHz
Bus Speed 5 GT/s DMI
Die size 216 mm 117 mm
L1 cache 64 KB (per core) 128 KB (per core)
L2 cache 256 KB (per core) 512 KB (per core)
L3 cache 8192 KB (shared)
Manufacturing process technology 32 nm 45 nm
Maximum core temperature 72.6°C
Maximum frequency 3.90 GHz 2.6 GHz
Number of cores 4 1
Number of threads 8
Transistor count 1160 million 234 million
Unlocked

Memory

Max memory channels 2
Maximum memory bandwidth 21 GB/s
Maximum memory size 32 GB
Supported memory types DDR3 1066/1333 DDR3

Graphics

Device ID 0x112
Graphics base frequency 850 MHz
Graphics max dynamic frequency 1.35 GHz
Graphics max frequency 1.35 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel® HD Graphics 3000

Graphics interfaces

Number of displays supported 2
Wireless Display (WiDi) support

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 37.5mm
Sockets supported LGA1155 AM3
Thermal Design Power (TDP) 95 Watt 45 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)