Intel Core i7-4700EC vs Intel Core i7-4702EC
Comparative analysis of Intel Core i7-4700EC and Intel Core i7-4702EC processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Core i7-4702EC
- Around 59% lower typical power consumption: 27 Watt vs 43 Watt
| Thermal Design Power (TDP) | 27 Watt vs 43 Watt |
Compare specifications (specs)
| Intel Core i7-4700EC | Intel Core i7-4702EC | |
|---|---|---|
Essentials |
||
| Architecture codename | Haswell | Haswell |
| Launch date | Q1'14 | Q1'14 |
| Place in performance rating | not rated | not rated |
| Processor Number | i7-4700EC | i7-4702EC |
| Series | 4th Generation Intel® Core™ i7 Processors | 4th Generation Intel® Core™ i7 Processors |
| Status | Launched | Launched |
| Vertical segment | Embedded | Embedded |
Performance |
||
| 64 bit support | ||
| Base frequency | 2.70 GHz | 2.00 GHz |
| Bus Speed | 5 GT/s DMI | 5 GT/s DMI |
| Manufacturing process technology | 22 nm | 22 nm |
| Maximum core temperature | 100°C | 100°C |
| Number of cores | 4 | 4 |
| Number of threads | 8 | 8 |
Memory |
||
| Max memory channels | 2 | 2 |
| Maximum memory bandwidth | 25.6 GB/s | 25.6 GB/s |
| Maximum memory size | 32 GB | 32 GB |
| Supported memory types | DDR3L 1333/1600 | DDR3L 1333/1600 |
Graphics |
||
| Intel® Clear Video HD technology | ||
| Intel® Flexible Display Interface (Intel® FDI) | ||
| Intel® InTru™ 3D technology | ||
| Intel® Quick Sync Video | ||
| Max video memory | 2 GB | 2 GB |
Graphics interfaces |
||
| DisplayPort | ||
| eDP | ||
| HDMI | ||
| Number of displays supported | 3 | 3 |
| VGA | ||
Graphics API support |
||
| DirectX | 11.2/12 | 11.2/12 |
| OpenGL | 4.3 | 4.3 |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Package Size | 37.5mm x 32mm x 1.6mm | 37.5mm x 32mm x 1.6mm |
| Sockets supported | FCBGA1364 | FCBGA1364 |
| Thermal Design Power (TDP) | 43 Watt | 27 Watt |
Peripherals |
||
| Max number of PCIe lanes | 16 | 16 |
| PCI Express revision | 3.0 | 3.0 |
| PCIe configurations | Up to 1x16, 2x8, 1x8 2x4 | Up to 1x16, 2x8, 1x8 2x4 |
Security & Reliability |
||
| Execute Disable Bit (EDB) | ||
| Intel® Identity Protection technology | ||
| Intel® Secure Key technology | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Enhanced Intel SpeedStep® technology | ||
| Idle States | ||
| Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Hyper-Threading technology | ||
| Intel® TSX-NI | ||
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
| Intel® VT-x with Extended Page Tables (EPT) | ||