Intel Core i7-4790S vs AMD Phenom II X3 740 BE
Comparative analysis of Intel Core i7-4790S and AMD Phenom II X3 740 BE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).
Differences
Reasons to consider the Intel Core i7-4790S
- CPU is newer: launch date 4 year(s) 7 month(s) later
- 1 more cores, run more applications at once: 4 vs 3
- Around 33% higher clock speed: 4.00 GHz vs 3 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
- Around 33% more L3 cache; more data can be stored in the L3 cache for quick access later
- Around 46% lower typical power consumption: 65 Watt vs 95 Watt
- 2.2x better performance in PassMark - Single thread mark: 2206 vs 982
- 4.9x better performance in PassMark - CPU mark: 7022 vs 1424
Specifications (specs) | |
Launch date | 1 May 2014 vs September 2009 |
Number of cores | 4 vs 3 |
Maximum frequency | 4.00 GHz vs 3 GHz |
Manufacturing process technology | 22 nm vs 45 nm |
L3 cache | 8 MB vs 6144 KB (shared) |
Thermal Design Power (TDP) | 65 Watt vs 95 Watt |
Benchmarks | |
PassMark - Single thread mark | 2206 vs 982 |
PassMark - CPU mark | 7022 vs 1424 |
Reasons to consider the AMD Phenom II X3 740 BE
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
- 2x better performance in Geekbench 4 - Single Core: 1836 vs 910
- Around 39% better performance in Geekbench 4 - Multi-Core: 4510 vs 3239
Specifications (specs) | |
Unlocked | Unlocked vs Locked |
L1 cache | 128 KB (per core) vs 256 KB |
L2 cache | 512 KB (per core) vs 1 MB |
Benchmarks | |
Geekbench 4 - Single Core | 1836 vs 910 |
Geekbench 4 - Multi-Core | 4510 vs 3239 |
Compare benchmarks
CPU 1: Intel Core i7-4790S
CPU 2: AMD Phenom II X3 740 BE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Core i7-4790S | AMD Phenom II X3 740 BE |
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PassMark - Single thread mark | 2206 | 982 |
PassMark - CPU mark | 7022 | 1424 |
Geekbench 4 - Single Core | 910 | 1836 |
Geekbench 4 - Multi-Core | 3239 | 4510 |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 5.16 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 86.186 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.639 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.48 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 6.08 | |
GFXBench 4.0 - Car Chase Offscreen (Frames) | 1296 | |
GFXBench 4.0 - Manhattan (Frames) | 2036 | |
GFXBench 4.0 - T-Rex (Frames) | 3347 | |
GFXBench 4.0 - Car Chase Offscreen (Fps) | 1296 | |
GFXBench 4.0 - Manhattan (Fps) | 2036 | |
GFXBench 4.0 - T-Rex (Fps) | 3347 |
Compare specifications (specs)
Intel Core i7-4790S | AMD Phenom II X3 740 BE | |
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Essentials |
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Architecture codename | Haswell | Heka |
Launch date | 1 May 2014 | September 2009 |
Launch price (MSRP) | $303 | |
Place in performance rating | 1650 | 1642 |
Price now | $498.91 | |
Processor Number | i7-4790S | |
Series | 4th Generation Intel® Core™ i7 Processors | |
Status | Launched | |
Value for money (0-100) | 5.65 | |
Vertical segment | Desktop | Desktop |
Performance |
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64 bit support | ||
Base frequency | 3.20 GHz | |
Bus Speed | 5 GT/s DMI2 | |
Die size | 177 mm | 258 mm |
L1 cache | 256 KB | 128 KB (per core) |
L2 cache | 1 MB | 512 KB (per core) |
L3 cache | 8 MB | 6144 KB (shared) |
Manufacturing process technology | 22 nm | 45 nm |
Maximum case temperature (TCase) | 71 °C | |
Maximum core temperature | 71.35°C | |
Maximum frequency | 4.00 GHz | 3 GHz |
Number of cores | 4 | 3 |
Number of threads | 8 | |
Transistor count | 1400 Million | 758 million |
Unlocked | ||
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 25.6 GB/s | |
Maximum memory size | 32 GB | |
Supported memory types | DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V | DDR3 |
Graphics |
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Device ID | 0x412 | |
Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.20 GHz | |
Graphics max frequency | 1.2 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 2 GB | |
Processor graphics | Intel® HD Graphics 4600 | |
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | |
VGA | ||
Wireless Display (WiDi) support | ||
Graphics image quality |
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Max resolution over DisplayPort | 3840x2160@60Hz | |
Max resolution over eDP | 3840x2160@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Max resolution over VGA | 1920x1200@60Hz | |
Graphics API support |
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DirectX | 11.2/12 | |
OpenGL | 4.3 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1150 | AM3 |
Thermal Design Power (TDP) | 65 Watt | 95 Watt |
Thermal Solution | PCG 2013C | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | Up to 3.0 | |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |