Intel Core i7-4790S vs AMD Phenom II X3 740 BE

Comparative analysis of Intel Core i7-4790S and AMD Phenom II X3 740 BE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the Intel Core i7-4790S

  • CPU is newer: launch date 4 year(s) 7 month(s) later
  • 1 more cores, run more applications at once: 4 vs 3
  • Around 33% higher clock speed: 4.00 GHz vs 3 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
  • Around 33% more L3 cache; more data can be stored in the L3 cache for quick access later
  • Around 46% lower typical power consumption: 65 Watt vs 95 Watt
  • 2.2x better performance in PassMark - Single thread mark: 2204 vs 982
  • 4.9x better performance in PassMark - CPU mark: 7016 vs 1424
Specifications (specs)
Launch date 1 May 2014 vs September 2009
Number of cores 4 vs 3
Maximum frequency 4.00 GHz vs 3 GHz
Manufacturing process technology 22 nm vs 45 nm
L3 cache 8 MB vs 6144 KB (shared)
Thermal Design Power (TDP) 65 Watt vs 95 Watt
Benchmarks
PassMark - Single thread mark 2204 vs 982
PassMark - CPU mark 7016 vs 1424

Reasons to consider the AMD Phenom II X3 740 BE

  • Processor is unlocked, an unlocked multiplier allows for easier overclocking
  • Around 50% more L1 cache; more data can be stored in the L1 cache for quick access later
  • Around 50% more L2 cache; more data can be stored in the L2 cache for quick access later
  • 2x better performance in Geekbench 4 - Single Core: 1836 vs 910
  • Around 39% better performance in Geekbench 4 - Multi-Core: 4510 vs 3239
Specifications (specs)
Unlocked Unlocked vs Locked
L1 cache 128 KB (per core) vs 256 KB
L2 cache 512 KB (per core) vs 1 MB
Benchmarks
Geekbench 4 - Single Core 1836 vs 910
Geekbench 4 - Multi-Core 4510 vs 3239

Compare benchmarks

CPU 1: Intel Core i7-4790S
CPU 2: AMD Phenom II X3 740 BE

PassMark - Single thread mark
CPU 1
CPU 2
2204
982
PassMark - CPU mark
CPU 1
CPU 2
7016
1424
Geekbench 4 - Single Core
CPU 1
CPU 2
910
1836
Geekbench 4 - Multi-Core
CPU 1
CPU 2
3239
4510
Name Intel Core i7-4790S AMD Phenom II X3 740 BE
PassMark - Single thread mark 2204 982
PassMark - CPU mark 7016 1424
Geekbench 4 - Single Core 910 1836
Geekbench 4 - Multi-Core 3239 4510
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 5.16
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 86.186
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.639
CompuBench 1.5 Desktop - Video Composition (Frames/s) 2.48
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 6.08
GFXBench 4.0 - Car Chase Offscreen (Frames) 1296
GFXBench 4.0 - Manhattan (Frames) 2036
GFXBench 4.0 - T-Rex (Frames) 3347
GFXBench 4.0 - Car Chase Offscreen (Fps) 1296
GFXBench 4.0 - Manhattan (Fps) 2036
GFXBench 4.0 - T-Rex (Fps) 3347

Compare specifications (specs)

Intel Core i7-4790S AMD Phenom II X3 740 BE

Essentials

Architecture codename Haswell Heka
Launch date 1 May 2014 September 2009
Launch price (MSRP) $303
Place in performance rating 1649 1642
Price now $498.91
Processor Number i7-4790S
Series 4th Generation Intel® Core™ i7 Processors
Status Launched
Value for money (0-100) 5.65
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 3.20 GHz
Bus Speed 5 GT/s DMI2
Die size 177 mm 258 mm
L1 cache 256 KB 128 KB (per core)
L2 cache 1 MB 512 KB (per core)
L3 cache 8 MB 6144 KB (shared)
Manufacturing process technology 22 nm 45 nm
Maximum case temperature (TCase) 71 °C
Maximum core temperature 71.35°C
Maximum frequency 4.00 GHz 3 GHz
Number of cores 4 3
Number of threads 8
Transistor count 1400 Million 758 million
Unlocked

Memory

Max memory channels 2
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 32 GB
Supported memory types DDR3-1333/1600, DDR3L-1333/1600 @ 1.5V DDR3

Graphics

Device ID 0x412
Graphics base frequency 350 MHz
Graphics max dynamic frequency 1.20 GHz
Graphics max frequency 1.2 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory 2 GB
Processor graphics Intel® HD Graphics 4600

Graphics interfaces

DisplayPort
DVI
eDP
HDMI
Number of displays supported 3
VGA
Wireless Display (WiDi) support

Graphics image quality

Max resolution over DisplayPort 3840x2160@60Hz
Max resolution over eDP 3840x2160@60Hz
Max resolution over HDMI 1.4 4096x2304@24Hz
Max resolution over VGA 1920x1200@60Hz

Graphics API support

DirectX 11.2/12
OpenGL 4.3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 37.5mm
Sockets supported FCLGA1150 AM3
Thermal Design Power (TDP) 65 Watt 95 Watt
Thermal Solution PCG 2013C

Peripherals

Max number of PCIe lanes 16
PCI Express revision Up to 3.0
PCIe configurations Up to 1x16, 2x8, 1x8+2x4
Scalability 1S Only

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® My WiFi technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring

Virtualization

AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)