Intel Core i7-4870HQ vs AMD Opteron 3320 EE

Comparative analysis of Intel Core i7-4870HQ and AMD Opteron 3320 EE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the Intel Core i7-4870HQ

  • 4 more threads: 8 vs 4
  • Around 48% higher clock speed: 3.70 GHz vs 2.5 GHz
  • Around 43% higher maximum core temperature: 100 °C vs 70°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
  • Around 33% more L1 cache; more data can be stored in the L1 cache for quick access later
  • 2.6x better performance in PassMark - Single thread mark: 2051 vs 774
  • 2.4x better performance in PassMark - CPU mark: 6304 vs 2675
Specifications (specs)
Number of threads 8 vs 4
Maximum frequency 3.70 GHz vs 2.5 GHz
Maximum core temperature 100 °C vs 70°C
Manufacturing process technology 22 nm vs 32 nm
L1 cache 256 KB vs 192 KB
Benchmarks
PassMark - Single thread mark 2051 vs 774
PassMark - CPU mark 6304 vs 2675

Reasons to consider the AMD Opteron 3320 EE

  • CPU is newer: launch date 10 year(s) 11 month(s) later
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 33% more L3 cache; more data can be stored in the L3 cache for quick access later
  • Around 88% lower typical power consumption: 25 Watt vs 47 Watt
Launch date 2012 vs 21 July 2014
L2 cache 4 MB vs 1 MB
L3 cache 8 MB vs 6 MB
Thermal Design Power (TDP) 25 Watt vs 47 Watt

Compare benchmarks

CPU 1: Intel Core i7-4870HQ
CPU 2: AMD Opteron 3320 EE

PassMark - Single thread mark
CPU 1
CPU 2
2051
774
PassMark - CPU mark
CPU 1
CPU 2
6304
2675
Name Intel Core i7-4870HQ AMD Opteron 3320 EE
PassMark - Single thread mark 2051 774
PassMark - CPU mark 6304 2675
Geekbench 4 - Single Core 856
Geekbench 4 - Multi-Core 3176
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 4.852
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 82.87
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.606
CompuBench 1.5 Desktop - Video Composition (Frames/s) 2.077
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 5.785
GFXBench 4.0 - Car Chase Offscreen (Frames) 2015
GFXBench 4.0 - Manhattan (Frames) 4897
GFXBench 4.0 - T-Rex (Frames) 7403
GFXBench 4.0 - Car Chase Offscreen (Fps) 2015
GFXBench 4.0 - Manhattan (Fps) 4897
GFXBench 4.0 - T-Rex (Fps) 7403

Compare specifications (specs)

Intel Core i7-4870HQ AMD Opteron 3320 EE

Essentials

Architecture codename Crystal Well Delhi
Launch date 21 July 2014 2012
Launch price (MSRP) $434
Place in performance rating 1017 2539
Processor Number i7-4870HQ
Series 4th Generation Intel® Core™ i7 Processors AMD Opteron 3300 Series Processor
Status Launched
Vertical segment Mobile Server
Family AMD Opteron
OPN Tray OS3320SJW4KHK

Performance

64 bit support
Base frequency 2.50 GHz 1.9 GHz
Bus Speed 5 GT/s DMI2
Die size 260 mm 315 mm
L1 cache 256 KB 192 KB
L2 cache 1 MB 4 MB
L3 cache 6 MB 8 MB
Manufacturing process technology 22 nm 32 nm
Maximum case temperature (TCase) 100 °C
Maximum core temperature 100 °C 70°C
Maximum frequency 3.70 GHz 2.5 GHz
Number of cores 4 4
Number of threads 8 4
Transistor count 1700 Million 1200 million
Unlocked

Memory

Max memory channels 2
Maximum memory bandwidth 25.6 GB/s
Maximum memory size 32 GB
Supported memory types DDR3L 1333/1600 DDR3
Supported memory frequency 1400 MHz

Graphics

Device ID 0xD26
Graphics base frequency 200 MHz
Graphics max dynamic frequency 1.20 GHz
Graphics max frequency 1.2 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory 2 GB
Processor graphics Intel® Iris® Pro Graphics 5200

Graphics interfaces

DisplayPort
eDP
HDMI
Number of displays supported 3
VGA
Wireless Display (WiDi) support

Graphics image quality

Max resolution over DisplayPort 3840x2160@60Hz
Max resolution over HDMI 1.4 2560x1600@60Hz
Max resolution over VGA 1920x1200@60Hz

Graphics API support

DirectX 11.2/12
OpenGL 4.3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 32mm x 1.65mm
Sockets supported FCBGA1364 AM3+
Thermal Design Power (TDP) 47 Watt 25 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 3
PCIe configurations 1x16 or 2x8 or 1x8 2x4

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Flexible Display interface (FDI)
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Fused Multiply-Add (FMA)

Virtualization

AMD Virtualization (AMD-V™)
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)