Intel Core i7-620LE vs Intel Core i3-330E

Comparative analysis of Intel Core i7-620LE and Intel Core i3-330E processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Core i7-620LE

Intel Core i3-330E

Differences

Reasons to consider the Intel Core i7-620LE

Around 17% higher maximum core temperature: 105°C vs 90°C for rPGA,105°C for BGA
Around 40% lower typical power consumption: 25 Watt vs 35 Watt

Maximum core temperature	105°C vs 90°C for rPGA,105°C for BGA
Thermal Design Power (TDP)	25 Watt vs 35 Watt

Compare benchmarks

CPU 1: Intel Core i7-620LE
CPU 2: Intel Core i3-330E

Name	Intel Core i7-620LE	Intel Core i3-330E
PassMark - Single thread mark		934
PassMark - CPU mark		1260

Compare specifications (specs)

	Intel Core i7-620LE	Intel Core i3-330E
Essentials
Architecture codename	Arrandale	Arrandale
Launch date	Q1'10	Q1'10
Place in performance rating	not rated	2353
Processor Number	i7-620LE	i3-330E
Series	Legacy Intel® Core™ Processors	Legacy Intel® Core™ Processors
Status	Launched	Launched
Vertical segment	Embedded	Mobile
Performance
64 bit support
Base frequency	2.00 GHz	2.13 GHz
Bus Speed	2.5 GT/s DMI	2.5 GT/s DMI
Die size	81 mm2	81 mm2
Manufacturing process technology	32 nm	32 nm
Maximum core temperature	105°C	90°C for rPGA,105°C for BGA
Maximum frequency	2.80 GHz
Number of cores	2	2
Number of threads	4	4
Transistor count	382 million	382 million
Memory
Max memory channels	2	2
Maximum memory bandwidth	17.1 GB/s	17.1 GB/s
Maximum memory size	8.79 GB	8.79 GB
Supported memory types	DDR3 800/1066	DDR3 800/1066
Graphics
Graphics base frequency	266 MHz	500 MHz
Graphics max dynamic frequency	566 MHz	667 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® Flexible Display Interface (Intel® FDI)
Processor graphics		Intel HD Graphics
Graphics interfaces
Number of displays supported	2	2
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	BGA 34mmX28mm	BGA 34mmX28mm
Sockets supported	BGA1288	BGA1288
Thermal Design Power (TDP)	25 Watt	35 Watt
Peripherals
Max number of PCIe lanes	1	16
PCI Express revision	2.0	2.0
PCIe configurations	1X16, 2X8	1X16, 2X8
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2	Intel® SSE4.1, Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)	36-bit	36-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)