Intel Core i7-860 vs Intel Core 2 Duo E4700

Comparative analysis of Intel Core i7-860 and Intel Core 2 Duo E4700 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

 

Differences

Reasons to consider the Intel Core i7-860

  • CPU is newer: launch date 1 year(s) 6 month(s) later
  • 2 more cores, run more applications at once: 4 vs 2
  • Around 33% higher clock speed: 3.46 GHz vs 2.6 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
  • 4x more L1 cache, more data can be stored in the L1 cache for quick access later
  • Around 34% better performance in PassMark - Single thread mark: 1329 vs 990
  • 3.3x better performance in PassMark - CPU mark: 2993 vs 908
  • Around 63% better performance in Geekbench 4 - Single Core: 507 vs 311
  • 3.7x better performance in Geekbench 4 - Multi-Core: 1890 vs 512
Specifications (specs)
Launch date September 2009 vs March 2008
Number of cores 4 vs 2
Maximum frequency 3.46 GHz vs 2.6 GHz
Manufacturing process technology 45 nm vs 65 nm
L1 cache 64 KB (per core) vs 64 KB
Benchmarks
PassMark - Single thread mark 1329 vs 990
PassMark - CPU mark 2993 vs 908
Geekbench 4 - Single Core 507 vs 311
Geekbench 4 - Multi-Core 1890 vs 512

Reasons to consider the Intel Core 2 Duo E4700

  • Around 1% higher maximum core temperature: 73.3°C vs 72.7°C
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 46% lower typical power consumption: 65 Watt vs 95 Watt
Maximum core temperature 73.3°C vs 72.7°C
L2 cache 2048 KB vs 256 KB (per core)
Thermal Design Power (TDP) 65 Watt vs 95 Watt

Compare benchmarks

CPU 1: Intel Core i7-860
CPU 2: Intel Core 2 Duo E4700

PassMark - Single thread mark
CPU 1
CPU 2
1329
990
PassMark - CPU mark
CPU 1
CPU 2
2993
908
Geekbench 4 - Single Core
CPU 1
CPU 2
507
311
Geekbench 4 - Multi-Core
CPU 1
CPU 2
1890
512
Name Intel Core i7-860 Intel Core 2 Duo E4700
PassMark - Single thread mark 1329 990
PassMark - CPU mark 2993 908
Geekbench 4 - Single Core 507 311
Geekbench 4 - Multi-Core 1890 512
3DMark Fire Strike - Physics Score 2296
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 0.949
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 49.877
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.312
CompuBench 1.5 Desktop - Video Composition (Frames/s) 1.485
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 4.161

Compare specifications (specs)

Intel Core i7-860 Intel Core 2 Duo E4700

Essentials

Architecture codename Lynnfield Conroe
Launch date September 2009 March 2008
Launch price (MSRP) $229
Place in performance rating 2753 2756
Price now $289.95 $26.99
Processor Number i7-860 E4700
Series Legacy Intel® Core™ Processors Legacy Intel® Core™ Processors
Status Discontinued Discontinued
Value for money (0-100) 5.09 16.19
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 2.80 GHz 2.60 GHz
Bus Speed 2.5 GT/s DMI 800 MHz FSB
Die size 296 mm2 111 mm2
L1 cache 64 KB (per core) 64 KB
L2 cache 256 KB (per core) 2048 KB
L3 cache 8192 KB (shared)
Manufacturing process technology 45 nm 65 nm
Maximum core temperature 72.7°C 73.3°C
Maximum frequency 3.46 GHz 2.6 GHz
Number of cores 4 2
Number of threads 8
Transistor count 774 million 167 million
VID voltage range 0.6500V-1.4000V 0.8500V-1.5V

Memory

Max memory channels 2
Maximum memory bandwidth 21 GB/s
Maximum memory size 16 GB
Supported memory types DDR3 1066/1333 DDR1, DDR2, DDR3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Package Size 37.5mm x 37.5mm 37.5mm x 37.5mm
Sockets supported LGA1156 PLGA775
Thermal Design Power (TDP) 95 Watt 65 Watt

Peripherals

Max number of PCIe lanes 16
PCI Express revision 2.0
PCIe configurations 1x16, 2x8

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 36-bit
Thermal Monitoring
FSB parity

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)