Intel Core i9-13900T vs AMD Ryzen 9 7900X3D
Comparative analysis of Intel Core i9-13900T and AMD Ryzen 9 7900X3D processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, 3DMark Fire Strike - Physics Score.
Differences
Reasons to consider the Intel Core i9-13900T
- 12 more cores, run more applications at once: 24 vs 12
- 8 more threads: 32 vs 24
- Around 12% higher maximum core temperature: 100°C vs 89 °C
- 2.5x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2.7x more L2 cache, more data can be stored in the L2 cache for quick access later
- 3.4x lower typical power consumption: 35 Watt vs 120 Watt
- Around 2% better performance in PassMark - Single thread mark: 4201 vs 4132
Specifications (specs) | |
Number of cores | 24 vs 12 |
Number of threads | 32 vs 24 |
Maximum core temperature | 100°C vs 89 °C |
L1 cache | 1920 KB vs 768 KB |
L2 cache | 32 MB vs 12 MB |
Thermal Design Power (TDP) | 35 Watt vs 120 Watt |
Benchmarks | |
PassMark - Single thread mark | 4201 vs 4132 |
Reasons to consider the AMD Ryzen 9 7900X3D
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- Around 6% higher clock speed: 5.6 GHz vs 5.30 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 7 nm
- 3.6x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 14% better performance in PassMark - CPU mark: 50405 vs 44125
Specifications (specs) | |
Unlocked | Unlocked vs Locked |
Maximum frequency | 5.6 GHz vs 5.30 GHz |
Manufacturing process technology | 5 nm vs 7 nm |
L3 cache | 128 MB vs 36 MB |
Benchmarks | |
PassMark - CPU mark | 50405 vs 44125 |
Compare benchmarks
CPU 1: Intel Core i9-13900T
CPU 2: AMD Ryzen 9 7900X3D
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Core i9-13900T | AMD Ryzen 9 7900X3D |
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PassMark - Single thread mark | 4201 | 4132 |
PassMark - CPU mark | 44125 | 50405 |
3DMark Fire Strike - Physics Score | 11579 |
Compare specifications (specs)
Intel Core i9-13900T | AMD Ryzen 9 7900X3D | |
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Essentials |
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Architecture codename | Raptor Lake | Zen 4 |
Launch date | 4 Jan 2023 | 4 Jan 2023 |
Launch price (MSRP) | $549 | |
Place in performance rating | 85 | 108 |
Processor Number | i9-13900T | |
Series | 13th Generation Intel Core i9 Processors | |
Vertical segment | Desktop | Desktop |
OPN Tray | 100-000000909 | |
Performance |
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64 bit support | ||
L1 cache | 1920 KB | 768 KB |
L2 cache | 32 MB | 12 MB |
L3 cache | 36 MB | 128 MB |
Manufacturing process technology | 7 nm | 5 nm |
Maximum core temperature | 100°C | 89 °C |
Maximum frequency | 5.30 GHz | 5.6 GHz |
Number of cores | 24 | 12 |
Number of threads | 32 | 24 |
Base frequency | 4.4 GHz | |
Die size | 71 mm² | |
Maximum case temperature (TCase) | 47 °C | |
Transistor count | 13140 million | |
Unlocked | ||
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 89.6 GB/s | |
Maximum memory size | 128 GB | |
Supported memory types | Up to DDR5 5600 MT/s Up to DDR4 3200 MT/s | DDR5-5200 |
ECC memory support | ||
Graphics |
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Device ID | 0xA780 | |
Execution Units | 32 | |
Graphics base frequency | 300 MHz | |
Graphics max dynamic frequency | 1.65 GHz | |
Intel® Clear Video HD technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel UHD Graphics 770 | |
Graphics interfaces |
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Number of displays supported | 4 | |
Graphics image quality |
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Max resolution over DisplayPort | 7680 x 4320 @ 60Hz | |
Max resolution over eDP | 5120 x 3200 @ 120Hz | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.5 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Package Size | 45.0 mm x 37.5 mm | |
Sockets supported | FCLGA1700 | AM5 |
Thermal Design Power (TDP) | 35 Watt | 120 Watt |
Thermal Solution | PCG 2020D | |
Peripherals |
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Max number of PCIe lanes | 20 | 24 |
PCI Express revision | 5.0 and 4.0 | 5.0 |
PCIe configurations | Up to 1x16+4, 2x8+4 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Secure Boot | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel SSE4.1, Intel SSE4.2, Intel AVX2 | |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Speed Shift technology | ||
Thermal Monitoring | ||
Enhanced Virus Protection (EVP) | ||
Fused Multiply-Add 3 (FMA3) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Advanced Vector Extensions 2 (AVX2) | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |