Intel Mobile A A110 vs Intel Celeron 420
Comparative analysis of Intel Mobile A A110 and Intel Celeron 420 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Memory, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Mobile A A110
- 11.7x lower typical power consumption: 3 Watt vs 35 Watt
Thermal Design Power (TDP) | 3 Watt vs 35 Watt |
Reasons to consider the Intel Celeron 420
- Around 100% higher clock speed: 1.6 GHz vs 0.8 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
Maximum frequency | 1.6 GHz vs 0.8 GHz |
Manufacturing process technology | 65 nm vs 90 nm |
Compare benchmarks
CPU 1: Intel Mobile A A110
CPU 2: Intel Celeron 420
Name | Intel Mobile A A110 | Intel Celeron 420 |
---|---|---|
PassMark - Single thread mark | 471 | |
PassMark - CPU mark | 235 | |
Geekbench 4 - Single Core | 883 | |
Geekbench 4 - Multi-Core | 834 |
Compare specifications (specs)
Intel Mobile A A110 | Intel Celeron 420 | |
---|---|---|
Essentials |
||
Architecture codename | Stealey | Conroe |
Launch date | 4 June 2007 | June 2007 |
Place in performance rating | not rated | 2729 |
Series | Intel Mobile A | Legacy Intel® Celeron® Processor |
Vertical segment | Laptop | Desktop |
Launch price (MSRP) | $23 | |
Price now | $39.99 | |
Processor Number | 420 | |
Status | Discontinued | |
Value for money (0-100) | 3.31 | |
Performance |
||
64 bit support | ||
Front-side bus (FSB) | 400 MHz | |
L2 cache | 512 KB | 512 KB |
Manufacturing process technology | 90 nm | 65 nm |
Maximum frequency | 0.8 GHz | 1.6 GHz |
Number of cores | 1 | 1 |
Number of threads | 1 | |
Base frequency | 1.60 GHz | |
Bus Speed | 800 MHz FSB | |
Die size | 77 mm2 | |
L1 cache | 64 KB | |
Maximum case temperature (TCase) | 60 °C | |
Maximum core temperature | 60.4°C | |
Transistor count | 105 million | |
VID voltage range | 1.0000V-1.3375V | |
Compatibility |
||
Sockets supported | 663-ball micro-FCBGA | LGA775 |
Thermal Design Power (TDP) | 3 Watt | 35 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | |
Memory |
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Supported memory types | DDR1, DDR2, DDR3 | |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |