Intel Pentium 4 HT EE 3.46 vs Intel Celeron D 326

Comparative analysis of Intel Pentium 4 HT EE 3.46 and Intel Celeron D 326 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization, Security & Reliability.

 

Differences

Reasons to consider the Intel Pentium 4 HT EE 3.46

  • CPU is newer: launch date 0 month(s) later
  • Around 37% higher clock speed: 3.46 GHz vs 2.53 GHz
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
Launch date October 2004 vs September 2004
Maximum frequency 3.46 GHz vs 2.53 GHz
L2 cache 512 KB vs 256 KB

Reasons to consider the Intel Celeron D 326

  • Around 3% higher maximum core temperature: 67.7°C vs 66°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 90 nm vs 130 nm
  • 2x more L1 cache, more data can be stored in the L1 cache for quick access later
  • Around 32% lower typical power consumption: 84 Watt vs 110.7 Watt
Maximum core temperature 67.7°C vs 66°C
Manufacturing process technology 90 nm vs 130 nm
L1 cache 16 KB vs 8 KB
Thermal Design Power (TDP) 84 Watt vs 110.7 Watt

Compare specifications (specs)

Intel Pentium 4 HT EE 3.46 Intel Celeron D 326

Essentials

Architecture codename Northwood Prescott
Launch date October 2004 September 2004
Place in performance rating not rated not rated
Series Legacy Intel® Pentium® Processor Legacy Intel® Celeron® Processor
Status Discontinued Discontinued
Vertical segment Desktop Desktop
Processor Number 326

Performance

Base frequency 3.46 GHz 2.53 GHz
Bus Speed 1066 MHz FSB 533 MHz FSB
Die size 237 mm 112 mm2
L1 cache 8 KB 16 KB
L2 cache 512 KB 256 KB
L3 cache 2048 KB
Manufacturing process technology 130 nm 90 nm
Maximum core temperature 66°C 67.7°C
Maximum frequency 3.46 GHz 2.53 GHz
Number of cores 1 1
Transistor count 178 million 125 million
VID voltage range 1.287V-1.4V 1.250V-1.400V
64 bit support

Memory

Supported memory types DDR1, DDR2, DDR3 DDR1, DDR2, DDR3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Sockets supported PLGA775, LGA775 PLGA775, PLGA478
Thermal Design Power (TDP) 110.7 Watt 84 Watt
Package Size 37.5mm x 37.5mm

Advanced Technologies

Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Physical Address Extensions (PAE) 32-bit

Virtualization

Intel® Virtualization Technology (VT-x)

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

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