Intel Pentium 4 HT EE 3.46 vs Intel Pentium M 765

Comparative analysis of Intel Pentium 4 HT EE 3.46 and Intel Pentium M 765 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Advanced Technologies, Virtualization, Security & Reliability.

Intel Pentium 4 HT EE 3.46

Intel Pentium M 765

Differences

Reasons to consider the Intel Pentium 4 HT EE 3.46

Around 65% higher clock speed: 3.46 GHz vs 2.1 GHz

Maximum frequency	3.46 GHz vs 2.1 GHz

Reasons to consider the Intel Pentium M 765

Around 52% higher maximum core temperature: 100°C vs 66°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 90 nm vs 130 nm
4x more L1 cache, more data can be stored in the L1 cache for quick access later
4x more L2 cache, more data can be stored in the L2 cache for quick access later
13.9x lower typical power consumption: 7.5 Watt vs 110.7 Watt

Maximum core temperature	100°C vs 66°C
Manufacturing process technology	90 nm vs 130 nm
L1 cache	32 KB vs 8 KB
L2 cache	2048 KB vs 512 KB
Thermal Design Power (TDP)	7.5 Watt vs 110.7 Watt

Compare specifications (specs)

	Intel Pentium 4 HT EE 3.46	Intel Pentium M 765
Essentials
Architecture codename	Northwood	Dothan
Launch date	October 2004	October 2004
Place in performance rating	not rated	not rated
Series	Legacy Intel® Pentium® Processor	Legacy Intel® Pentium® Processor
Status	Discontinued	Discontinued
Vertical segment	Desktop	Mobile
Processor Number		765
Performance
Base frequency	3.46 GHz	2.10 GHz
Bus Speed	1066 MHz FSB	400 MHz FSB
Die size	237 mm	87 mm2
L1 cache	8 KB	32 KB
L2 cache	512 KB	2048 KB
L3 cache	2048 KB
Manufacturing process technology	130 nm	90 nm
Maximum core temperature	66°C	100°C
Maximum frequency	3.46 GHz	2.1 GHz
Number of cores	1	1
Transistor count	178 million	144 million
VID voltage range	1.287V-1.4V	0.988-1.356V
64 bit support
Front-side bus (FSB)		400 MHz
Number of threads		1
Memory
Supported memory types	DDR1, DDR2, DDR3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Sockets supported	PLGA775, LGA775	PPGA478, H-PBGA479
Thermal Design Power (TDP)	110.7 Watt	7.5 Watt
Package Size		35mm x 35mm
Advanced Technologies
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Physical Address Extensions (PAE)		32-bit
Virtualization
Intel® Virtualization Technology (VT-x)
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)