Intel Pentium D 840 vs Intel Pentium III 866

Comparative analysis of Intel Pentium D 840 and Intel Pentium III 866 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Pentium D 840

  • 1 more cores, run more applications at once: 2 vs 1
  • Around 268% higher clock speed: 3.2 GHz vs 0.87 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 90 nm vs 180 nm
  • 3.5x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 8x more L2 cache, more data can be stored in the L2 cache for quick access later
Number of cores 2 vs 1
Maximum frequency 3.2 GHz vs 0.87 GHz
Manufacturing process technology 90 nm vs 180 nm
L1 cache 28 KB vs 8 KB
L2 cache 2048 KB vs 256 KB
Max number of CPUs in a configuration 2 vs 1

Reasons to consider the Intel Pentium III 866

  • Around 15% higher maximum core temperature: 80°C vs 69.8°C
  • 5x lower typical power consumption: 26.1 Watt vs 130 Watt
Maximum core temperature 80°C vs 69.8°C
Thermal Design Power (TDP) 26.1 Watt vs 130 Watt

Compare benchmarks

CPU 1: Intel Pentium D 840
CPU 2: Intel Pentium III 866

Name Intel Pentium D 840 Intel Pentium III 866
Geekbench 4 - Single Core 186
Geekbench 4 - Multi-Core 309
PassMark - Single thread mark 202
PassMark - CPU mark 152

Compare specifications (specs)

Intel Pentium D 840 Intel Pentium III 866

Essentials

Architecture codename Smithfield Coppermine T
Launch date May 2005 Q1'00
Place in performance rating 3288 3293
Processor Number 840
Series Legacy Intel® Pentium® Processor Legacy Intel® Pentium® Processor
Status Discontinued Discontinued
Vertical segment Desktop Desktop

Performance

64 bit support
Base frequency 3.20 GHz 866 MHz
Bus Speed 800 MHz FSB 133 MHz FSB
Die size 206 mm2 80 mm
L1 cache 28 KB 8 KB
L2 cache 2048 KB 256 KB
Manufacturing process technology 90 nm 180 nm
Maximum core temperature 69.8°C 80°C
Maximum frequency 3.2 GHz 0.87 GHz
Number of cores 2 1
Transistor count 230 million 44 million
VID voltage range 1.200V-1.400V 1.75V
Maximum case temperature (TCase) 69 °C

Memory

Supported memory types DDR1, DDR2, DDR3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 2 1
Package Size 37.5mm x 37.5mm
Sockets supported PLGA775 PPGA370, SECC2, SECC2495
Thermal Design Power (TDP) 130 Watt 26.1 Watt

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 32-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)