Intel Pentium D 820 vs Intel Pentium D 840
Comparative analysis of Intel Pentium D 820 and Intel Pentium D 840 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Pentium D 820
- Around 37% lower typical power consumption: 95 Watt vs 130 Watt
| Thermal Design Power (TDP) | 95 Watt vs 130 Watt |
Reasons to consider the Intel Pentium D 840
- Around 14% higher clock speed: 3.2 GHz vs 2.8 GHz
- Around 9% higher maximum core temperature: 69.8°C vs 64.1°C
- Around 4% better performance in Geekbench 4 - Single Core: 186 vs 179
- Around 1% better performance in Geekbench 4 - Multi-Core: 309 vs 307
| Specifications (specs) | |
| Maximum frequency | 3.2 GHz vs 2.8 GHz |
| Maximum core temperature | 69.8°C vs 64.1°C |
| Benchmarks | |
| Geekbench 4 - Single Core | 186 vs 179 |
| Geekbench 4 - Multi-Core | 309 vs 307 |
Compare benchmarks
CPU 1: Intel Pentium D 820
CPU 2: Intel Pentium D 840
| Geekbench 4 - Single Core |
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| Geekbench 4 - Multi-Core |
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| Name | Intel Pentium D 820 | Intel Pentium D 840 |
|---|---|---|
| Geekbench 4 - Single Core | 179 | 186 |
| Geekbench 4 - Multi-Core | 307 | 309 |
Compare specifications (specs)
| Intel Pentium D 820 | Intel Pentium D 840 | |
|---|---|---|
Essentials |
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| Architecture codename | Smithfield | Smithfield |
| Launch date | May 2005 | May 2005 |
| Place in performance rating | 3302 | 3298 |
| Processor Number | 820 | 840 |
| Series | Legacy Intel® Pentium® Processor | Legacy Intel® Pentium® Processor |
| Status | Discontinued | Discontinued |
| Vertical segment | Desktop | Desktop |
Performance |
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| 64 bit support | ||
| Base frequency | 2.80 GHz | 3.20 GHz |
| Bus Speed | 800 MHz FSB | 800 MHz FSB |
| Die size | 206 mm2 | 206 mm2 |
| Front-side bus (FSB) | 800 MHz | |
| L1 cache | 28 KB | 28 KB |
| L2 cache | 2048 KB | 2048 KB |
| Manufacturing process technology | 90 nm | 90 nm |
| Maximum core temperature | 64.1°C | 69.8°C |
| Maximum frequency | 2.8 GHz | 3.2 GHz |
| Number of cores | 2 | 2 |
| Number of threads | 2 | |
| Transistor count | 230 million | 230 million |
| VID voltage range | 1.200V-1.400V | 1.200V-1.400V |
Memory |
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| Supported memory types | DDR1, DDR2, DDR3 | DDR1, DDR2, DDR3 |
Compatibility |
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| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 2 | 2 |
| Package Size | 37.5mm x 37.5mm | 37.5mm x 37.5mm |
| Sockets supported | PLGA775 | PLGA775 |
| Thermal Design Power (TDP) | 95 Watt | 130 Watt |
Security & Reliability |
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| Execute Disable Bit (EDB) | ||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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| Enhanced Intel SpeedStep® technology | ||
| FSB parity | ||
| Idle States | ||
| Intel 64 | ||
| Intel® AES New Instructions | ||
| Intel® Demand Based Switching | ||
| Intel® Hyper-Threading technology | ||
| Intel® Turbo Boost technology | ||
| Physical Address Extensions (PAE) | 32-bit | 32-bit |
| Thermal Monitoring | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||
