Intel Pentium D 925 vs Intel Pentium III 800
Comparative analysis of Intel Pentium D 925 and Intel Pentium III 800 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the Intel Pentium D 925
- 1 more cores, run more applications at once: 2 vs 1
- Around 275% higher clock speed: 3 GHz vs 0.8 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 180 nm
- 3.5x more L1 cache, more data can be stored in the L1 cache for quick access later
- 16x more L2 cache, more data can be stored in the L2 cache for quick access later
Number of cores | 2 vs 1 |
Maximum frequency | 3 GHz vs 0.8 GHz |
Manufacturing process technology | 65 nm vs 180 nm |
L1 cache | 28 KB vs 8 KB |
L2 cache | 4096 KB vs 256 KB |
Max number of CPUs in a configuration | 2 vs 1 |
Reasons to consider the Intel Pentium III 800
- Around 26% higher maximum core temperature: 80°C vs 63.4°C
- 4.5x lower typical power consumption: 20.8 Watt vs 95 Watt
Maximum core temperature | 80°C vs 63.4°C |
Thermal Design Power (TDP) | 20.8 Watt vs 95 Watt |
Compare benchmarks
CPU 1: Intel Pentium D 925
CPU 2: Intel Pentium III 800
Name | Intel Pentium D 925 | Intel Pentium III 800 |
---|---|---|
Geekbench 4 - Single Core | 198 | |
Geekbench 4 - Multi-Core | 341 | |
PassMark - Single thread mark | 237 | |
PassMark - CPU mark | 182 |
Compare specifications (specs)
Intel Pentium D 925 | Intel Pentium III 800 | |
---|---|---|
Essentials |
||
Architecture codename | Presler | Coppermine T |
Launch date | October 2006 | n/d |
Place in performance rating | 3283 | 3273 |
Processor Number | 925 | |
Series | Legacy Intel® Pentium® Processor | Legacy Intel® Pentium® Processor |
Status | Discontinued | Discontinued |
Vertical segment | Desktop | Desktop |
Performance |
||
64 bit support | ||
Base frequency | 3.00 GHz | 800 MHz |
Bus Speed | 800 MHz FSB | 133 MHz FSB |
Die size | 162 mm2 | 80 mm |
L1 cache | 28 KB | 8 KB |
L2 cache | 4096 KB | 256 KB |
Manufacturing process technology | 65 nm | 180 nm |
Maximum core temperature | 63.4°C | 80°C |
Maximum frequency | 3 GHz | 0.8 GHz |
Number of cores | 2 | 1 |
Transistor count | 376 million | 44 million |
VID voltage range | 1.200V-1.3375V | 1.75V |
Maximum case temperature (TCase) | 69 °C | |
Memory |
||
Supported memory types | DDR1, DDR2, DDR3 | |
Compatibility |
||
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 2 | 1 |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | PLGA775 | PPGA370, SECC2, SECC2495 |
Thermal Design Power (TDP) | 95 Watt | 20.8 Watt |
Security & Reliability |
||
Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 32-bit | |
Thermal Monitoring | ||
Virtualization |
||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |