Intel Pentium D 955 EE vs AMD Opteron X2 870 HE
Comparative analysis of Intel Pentium D 955 EE and AMD Opteron X2 870 HE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Pentium D 955 EE
- CPU is newer: launch date 1 month(s) later
- Around 73% higher clock speed: 3.46 GHz vs 2 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
- 4x more L2 cache, more data can be stored in the L2 cache for quick access later
Launch date | January 2006 vs December 2005 |
Maximum frequency | 3.46 GHz vs 2 GHz |
Manufacturing process technology | 65 nm vs 90 nm |
L2 cache | 4096 KB vs 1024 KB |
Reasons to consider the AMD Opteron X2 870 HE
- 4.6x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2.4x lower typical power consumption: 55 Watt vs 130 Watt
L1 cache | 128 KB vs 28 KB |
Max number of CPUs in a configuration | 8 vs 2 |
Thermal Design Power (TDP) | 55 Watt vs 130 Watt |
Compare specifications (specs)
Intel Pentium D 955 EE | AMD Opteron X2 870 HE | |
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Essentials |
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Architecture codename | Presler | Egypt |
Launch date | January 2006 | December 2005 |
Place in performance rating | not rated | not rated |
Processor Number | 955 | |
Series | Legacy Intel® Pentium® Processor | |
Status | Discontinued | |
Vertical segment | Desktop | Server |
Performance |
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64 bit support | ||
Base frequency | 3.46 GHz | |
Bus Speed | 1066 MHz FSB | |
Die size | 162 mm2 | |
L1 cache | 28 KB | 128 KB |
L2 cache | 4096 KB | 1024 KB |
Manufacturing process technology | 65 nm | 90 nm |
Maximum core temperature | 68.6°C | |
Maximum frequency | 3.46 GHz | 2 GHz |
Number of cores | 2 | 2 |
Transistor count | 376 million | 233 million |
VID voltage range | 1.200V-1.3375V | |
Memory |
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Supported memory types | DDR1, DDR2, DDR3 | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 2 | 8 |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | PLGA775 | 940 |
Thermal Design Power (TDP) | 130 Watt | 55 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 32-bit | |
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) |