Intel Pentium D 955 EE vs Intel Xeon MP 7020 Dual-Core

Comparative analysis of Intel Pentium D 955 EE and Intel Xeon MP 7020 Dual-Core processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization.

 

Differences

Reasons to consider the Intel Pentium D 955 EE

  • CPU is newer: launch date 1 month(s) later
  • Around 30% higher clock speed: 3.46 GHz vs 2.67 GHz
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 65 nm vs 90 nm
  • Around 75% more L1 cache; more data can be stored in the L1 cache for quick access later
  • 4x more L2 cache, more data can be stored in the L2 cache for quick access later
  • Around 27% lower typical power consumption: 130 Watt vs 165 Watt
Launch date January 2006 vs December 2005
Maximum frequency 3.46 GHz vs 2.67 GHz
Manufacturing process technology 65 nm vs 90 nm
L1 cache 28 KB vs 16 KB
L2 cache 4096 KB vs 1024 KB
Thermal Design Power (TDP) 130 Watt vs 165 Watt

Reasons to consider the Intel Xeon MP 7020 Dual-Core

  • Around 11% higher maximum core temperature: 76°C vs 68.6°C
Maximum core temperature 76°C vs 68.6°C

Compare specifications (specs)

Intel Pentium D 955 EE Intel Xeon MP 7020 Dual-Core

Essentials

Architecture codename Presler Paxville
Launch date January 2006 December 2005
Place in performance rating not rated not rated
Processor Number 955 7020
Series Legacy Intel® Pentium® Processor Legacy Intel® Xeon® Processors
Status Discontinued Discontinued
Vertical segment Desktop Server

Performance

64 bit support
Base frequency 3.46 GHz 2.66 GHz
Bus Speed 1066 MHz FSB 667 MHz FSB
Die size 162 mm2 206 mm2
L1 cache 28 KB 16 KB
L2 cache 4096 KB 1024 KB
Manufacturing process technology 65 nm 90 nm
Maximum core temperature 68.6°C 76°C
Maximum frequency 3.46 GHz 2.67 GHz
Number of cores 2 2
Transistor count 376 million 230 million
VID voltage range 1.200V-1.3375V 1.2625V-1.4125V

Memory

Supported memory types DDR1, DDR2, DDR3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 2 2
Package Size 37.5mm x 37.5mm 53.3mm x 53.3mm
Sockets supported PLGA775 PPGA604
Thermal Design Power (TDP) 130 Watt 165 Watt

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE) 32-bit 32-bit
Thermal Monitoring

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)

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