Intel Pentium E5700 vs Intel Pentium 4 HT 631

Comparative analysis of Intel Pentium E5700 and Intel Pentium 4 HT 631 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Pentium E5700

Intel Pentium 4 HT 631

Differences

Reasons to consider the Intel Pentium E5700

CPU is newer: launch date 4 year(s) 7 month(s) later
1 more cores, run more applications at once: 2 vs 1
A newer manufacturing process allows for a more powerful, yet cooler running processor: 45 nm vs 65 nm
4.6x more L1 cache, more data can be stored in the L1 cache for quick access later
Around 32% lower typical power consumption: 65 Watt vs 86 Watt

Launch date	August 2010 vs January 2006
Number of cores	2 vs 1
Manufacturing process technology	45 nm vs 65 nm
L1 cache	64 KB (per core) vs 28 KB
Thermal Design Power (TDP)	65 Watt vs 86 Watt

Compare benchmarks

CPU 1: Intel Pentium E5700
CPU 2: Intel Pentium 4 HT 631

Name	Intel Pentium E5700	Intel Pentium 4 HT 631
PassMark - Single thread mark	1186
PassMark - CPU mark	1085
Geekbench 4 - Single Core	343
Geekbench 4 - Multi-Core	583

Compare specifications (specs)

	Intel Pentium E5700	Intel Pentium 4 HT 631
Essentials
Architecture codename	Wolfdale	Cedarmill
Launch date	August 2010	January 2006
Launch price (MSRP)	$110
Place in performance rating	2595	not rated
Price now	$14.99
Processor Number	E5700	631
Series	Legacy Intel® Pentium® Processor	Legacy Intel® Pentium® Processor
Status	Discontinued	Discontinued
Value for money (0-100)	34.17
Vertical segment	Desktop	Desktop
Performance
64 bit support
Base frequency	3.00 GHz	3.00 GHz
Bus Speed	800 MHz FSB	800 MHz FSB
Die size	82 mm2	81 mm2
L1 cache	64 KB (per core)	28 KB
L2 cache	2048 KB (shared)	2048 KB
Manufacturing process technology	45 nm	65 nm
Maximum core temperature	74.1°C	B1+C1=69.2°C. D0=64.1°C
Maximum frequency	3 GHz	3 GHz
Number of cores	2	1
Transistor count	228 million	188 million
VID voltage range	0.8500V-1.3625V	1.200V-1.3375V
Maximum case temperature (TCase)		69 °C
Memory
Supported memory types	DDR1, DDR2, DDR3	DDR1, DDR2, DDR3
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm	37.5mm x 37.5mm
Sockets supported	LGA775	PLGA775
Thermal Design Power (TDP)	65 Watt	86 Watt
Scenario Design Power (SDP)		0 W
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Thermal Monitoring
FSB parity
Physical Address Extensions (PAE)		32-bit
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)