Intel Pentium G3320TE vs Intel Core m3-6Y30

Comparative analysis of Intel Pentium G3320TE and Intel Core m3-6Y30 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics image quality, Graphics API support. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).

Intel Pentium G3320TE

Intel Core m3-6Y30

Differences

Reasons to consider the Intel Pentium G3320TE

2x more maximum memory size: 32 GB vs 16 GB
Around 12% better performance in PassMark - Single thread mark: 1312 vs 1173

Specifications (specs)
Maximum memory size	32 GB vs 16 GB
Benchmarks
PassMark - Single thread mark	1312 vs 1173

Reasons to consider the Intel Core m3-6Y30

2 more threads: 4 vs 2
Around 39% higher maximum core temperature: 100°C vs 72°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
7x lower typical power consumption: 4.5 Watt vs 35 Watt
Around 38% better performance in PassMark - CPU mark: 2170 vs 1570

Specifications (specs)
Number of threads	4 vs 2
Maximum core temperature	100°C vs 72°C
Manufacturing process technology	14 nm vs 22 nm
Thermal Design Power (TDP)	4.5 Watt vs 35 Watt
Benchmarks
PassMark - CPU mark	2170 vs 1570

Compare benchmarks

CPU 1: Intel Pentium G3320TE
CPU 2: Intel Core m3-6Y30

PassMark - Single thread mark

CPU 1

CPU 2

1312

1173

PassMark - CPU mark

CPU 1

CPU 2

1570

2170

Name	Intel Pentium G3320TE	Intel Core m3-6Y30
PassMark - Single thread mark	1312	1173
PassMark - CPU mark	1570	2170
Geekbench 4 - Single Core		2206
Geekbench 4 - Multi-Core		3799
CompuBench 1.5 Desktop - Face Detection (mPixels/s)		5.119
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)		27.415
CompuBench 1.5 Desktop - T-Rex (Frames/s)		0.276
CompuBench 1.5 Desktop - Video Composition (Frames/s)		1.744
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)		13.111
GFXBench 4.0 - Car Chase Offscreen (Frames)		1257
GFXBench 4.0 - Manhattan (Frames)		1581
GFXBench 4.0 - T-Rex (Frames)		2322
GFXBench 4.0 - Car Chase Offscreen (Fps)		1257
GFXBench 4.0 - Manhattan (Fps)		1581
GFXBench 4.0 - T-Rex (Fps)		2322

Compare specifications (specs)

	Intel Pentium G3320TE	Intel Core m3-6Y30
Essentials
Architecture codename	Haswell	Skylake
Launch date	Q3'13	1 September 2015
Place in performance rating	1927	1932
Processor Number	G3320TE	M3-6Y30
Series	Intel® Pentium® Processor G Series	6th Generation Intel® Core™ m Processors
Status	Launched	Launched
Vertical segment	Embedded	Mobile
Launch price (MSRP)		$281
Performance
64 bit support
Base frequency	2.30 GHz	900 MHz
Bus Speed	5 GT/s DMI2	4 GT/s OPI
Manufacturing process technology	22 nm	14 nm
Maximum core temperature	72°C	100°C
Number of cores	2	2
Number of QPI Links	1
Number of threads	2	4
Die size		99 mm
L1 cache		128 KB
L2 cache		512 KB
L3 cache		4 MB
Maximum frequency		2.20 GHz
Memory
Max memory channels	2	2
Maximum memory bandwidth	21.3 GB/s	29.8 GB/s
Maximum memory size	32 GB	16 GB
Supported memory types	DDR3-1333, DDR3L-1333 @ 1.5V	LPDDR3-1866, DDR3L-1600
Graphics
Graphics base frequency	350 MHz	300 MHz
Graphics max dynamic frequency	1.00 GHz	850 MHz
Intel® Clear Video HD technology
Intel® Quick Sync Video
Max video memory	1 GB	16 GB
Processor graphics	Intel HD Graphics	Intel® HD Graphics 515
Device ID		0x191E
Graphics max frequency		850 MHz
Intel® Clear Video technology
Intel® InTru™ 3D technology
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported	3	3
VGA
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Package Size	37.5mm x 37.5mm	20mm X 16.5mm
Sockets supported	FCLGA1150	FCBGA1515
Thermal Design Power (TDP)	35 Watt	4.5 Watt
Thermal Solution	PCG 2013A
Configurable TDP-down		3.8 W
Configurable TDP-up		7 W
Peripherals
Max number of PCIe lanes	16	10
PCI Express revision	3.0	3.0
PCIe configurations	Up to 1x16, 2x8, 1x8/2x4	1x4, 2x2, 1x2+2x1 and 4x1
Security & Reliability
Execute Disable Bit (EDB)
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Intel® Memory Protection Extensions (Intel® MPX)
Intel® OS Guard
Intel® Software Guard Extensions (Intel® SGX)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Stable Image Platform Program (SIPP)
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
Intel® Advanced Vector Extensions (AVX)
Intel® Flex Memory Access
Intel® My WiFi technology
Intel® Smart Response technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)
Graphics image quality
4K resolution support
Max resolution over DisplayPort		3840x2160@60Hz
Max resolution over eDP		3840x2160@60Hz
Max resolution over HDMI 1.4		4096@2304@24Hz
Max resolution over VGA		N / A
Max resolution over WiDi		1080p
Graphics API support
DirectX		12
OpenGL		4.5