AMD R-272F vs Intel Pentium G3320TE
Comparative analysis of AMD R-272F and Intel Pentium G3320TE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics API support, Compatibility, Peripherals, Advanced Technologies, Virtualization, Security & Reliability. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.
Differences
Reasons to consider the AMD R-272F
- Around 39% higher maximum core temperature: 100 °C vs 72°C
Maximum core temperature | 100 °C vs 72°C |
Reasons to consider the Intel Pentium G3320TE
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- Around 21% better performance in PassMark - Single thread mark: 1312 vs 1087
- Around 29% better performance in PassMark - CPU mark: 1570 vs 1215
Specifications (specs) | |
Manufacturing process technology | 22 nm vs 32 nm |
Benchmarks | |
PassMark - Single thread mark | 1312 vs 1087 |
PassMark - CPU mark | 1570 vs 1215 |
Compare benchmarks
CPU 1: AMD R-272F
CPU 2: Intel Pentium G3320TE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | AMD R-272F | Intel Pentium G3320TE |
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PassMark - Single thread mark | 1087 | 1312 |
PassMark - CPU mark | 1215 | 1570 |
Compare specifications (specs)
AMD R-272F | Intel Pentium G3320TE | |
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Essentials |
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Architecture codename | Piledriver | Haswell |
Launch date | 21 May 2012 | Q3'13 |
Place in performance rating | 2189 | 1928 |
Vertical segment | Embedded | Embedded |
Processor Number | G3320TE | |
Series | Intel® Pentium® Processor G Series | |
Status | Launched | |
Performance |
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64 bit support | ||
Base frequency | 2.7 GHz | 2.30 GHz |
L1 cache | 96 KB | |
L2 cache | 1 MB | |
Manufacturing process technology | 32 nm | 22 nm |
Maximum core temperature | 100 °C | 72°C |
Maximum frequency | 3.2 GHz | |
Number of cores | 2 | 2 |
Number of threads | 2 | 2 |
Bus Speed | 5 GT/s DMI2 | |
Number of QPI Links | 1 | |
Memory |
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Max memory channels | 2 | 2 |
Maximum memory bandwidth | 25.6 GB/s | 21.3 GB/s |
Supported memory types | DDR3-1600, DDR3L-1600, DDR3U-1600 | DDR3-1333, DDR3L-1333 @ 1.5V |
Maximum memory size | 32 GB | |
Graphics |
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Graphics base frequency | 497 MHz | 350 MHz |
Graphics max frequency | 686 MHz | |
Number of pipelines | 192 | |
Processor graphics | Radeon HD 7520G | Intel HD Graphics |
Unified Video Decoder (UVD) | ||
Video Codec Engine (VCE) | ||
Graphics max dynamic frequency | 1.00 GHz | |
Intel® Clear Video HD technology | ||
Intel® Quick Sync Video | ||
Max video memory | 1 GB | |
Graphics interfaces |
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DisplayPort | ||
DVI | ||
HDMI | ||
Number of displays supported | 4 | 3 |
VGA | ||
eDP | ||
Graphics API support |
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DirectX | 11 | |
OpenGL | 4.2 | |
Compatibility |
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Max number of CPUs in a configuration | 1 | 1 |
Sockets supported | FS1 | FCLGA1150 |
Thermal Design Power (TDP) | 35 Watt | 35 Watt |
Low Halogen Options Available | ||
Package Size | 37.5mm x 37.5mm | |
Thermal Solution | PCG 2013A | |
Peripherals |
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Max number of PCIe lanes | 16 | 16 |
PCI Express revision | 2.0 | 3.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8/2x4 | |
Advanced Technologies |
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Enhanced Virus Protection (EVP) | ||
Fused Multiply-Add 3 (FMA3) | ||
Fused Multiply-Add 4 (FMA4) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) |