Intel Pentium G640 vs AMD Phenom II X2 560 BE
Comparative analysis of Intel Pentium G640 and AMD Phenom II X2 560 BE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Pentium G640
- CPU is newer: launch date 1 year(s) 9 month(s) later
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- Around 23% lower typical power consumption: 65 Watt vs 80 Watt
- Around 15% better performance in Geekbench 4 - Single Core: 489 vs 426
- Around 14% better performance in Geekbench 4 - Multi-Core: 869 vs 764
Specifications (specs) | |
Launch date | June 2012 vs September 2010 |
Manufacturing process technology | 32 nm vs 45 nm |
Thermal Design Power (TDP) | 65 Watt vs 80 Watt |
Benchmarks | |
Geekbench 4 - Single Core | 489 vs 426 |
Geekbench 4 - Multi-Core | 869 vs 764 |
Reasons to consider the AMD Phenom II X2 560 BE
- Processor is unlocked, an unlocked multiplier allows for easier overclocking
- Around 18% higher clock speed: 3.3 GHz vs 2.8 GHz
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 6% better performance in PassMark - Single thread mark: 1389 vs 1306
- Around 2% better performance in PassMark - CPU mark: 1375 vs 1349
Specifications (specs) | |
Unlocked | Unlocked vs Locked |
Maximum frequency | 3.3 GHz vs 2.8 GHz |
L1 cache | 128 KB (per core) vs 64 KB (per core) |
L2 cache | 512 KB (per core) vs 256 KB (per core) |
L3 cache | 6144 KB (shared) vs 3072 KB (shared) |
Benchmarks | |
PassMark - Single thread mark | 1389 vs 1306 |
PassMark - CPU mark | 1375 vs 1349 |
Compare benchmarks
CPU 1: Intel Pentium G640
CPU 2: AMD Phenom II X2 560 BE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Pentium G640 | AMD Phenom II X2 560 BE |
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PassMark - Single thread mark | 1306 | 1389 |
PassMark - CPU mark | 1349 | 1375 |
Geekbench 4 - Single Core | 489 | 426 |
Geekbench 4 - Multi-Core | 869 | 764 |
Compare specifications (specs)
Intel Pentium G640 | AMD Phenom II X2 560 BE | |
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Essentials |
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Architecture codename | Sandy Bridge | Callisto |
Launch date | June 2012 | September 2010 |
Launch price (MSRP) | $179 | |
Place in performance rating | 2389 | 2378 |
Price now | $24.99 | |
Processor Number | G640 | |
Series | Legacy Intel® Pentium® Processor | |
Status | Discontinued | |
Value for money (0-100) | 29.86 | |
Vertical segment | Desktop | Desktop |
Performance |
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64 bit support | ||
Base frequency | 2.80 GHz | |
Bus Speed | 5 GT/s DMI | |
Die size | 131 mm | 258 mm |
L1 cache | 64 KB (per core) | 128 KB (per core) |
L2 cache | 256 KB (per core) | 512 KB (per core) |
L3 cache | 3072 KB (shared) | 6144 KB (shared) |
Manufacturing process technology | 32 nm | 45 nm |
Maximum core temperature | 69.1°C | |
Maximum frequency | 2.8 GHz | 3.3 GHz |
Number of cores | 2 | 2 |
Number of threads | 2 | |
Transistor count | 504 million | 758 million |
Unlocked | ||
Memory |
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Max memory channels | 2 | |
Maximum memory bandwidth | 17 GB/s | |
Maximum memory size | 32 GB | |
Supported memory types | DDR3 1066 | DDR3 |
Graphics |
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Graphics base frequency | 850 MHz | |
Graphics max dynamic frequency | 1.10 GHz | |
Graphics max frequency | 1.1 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel HD Graphics | |
Graphics interfaces |
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Number of displays supported | 2 | |
Wireless Display (WiDi) support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | |
Sockets supported | FCLGA1155 | AM3 |
Thermal Design Power (TDP) | 65 Watt | 80 Watt |
Peripherals |
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PCI Express revision | 2.0 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2 | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |