Intel Pentium III 1000S vs Intel Pentium III 800

Comparative analysis of Intel Pentium III 1000S and Intel Pentium III 800 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

Intel Pentium III 1000S

Intel Pentium III 800

Differences

Reasons to consider the Intel Pentium III 1000S

Around 25% higher clock speed: 1 GHz vs 0.8 GHz
Around 25% higher maximum core temperature: 100°C vs 80°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 130 nm vs 180 nm
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 75% lower typical power consumption: 12.1 Watt vs 20.8 Watt

Maximum frequency	1 GHz vs 0.8 GHz
Maximum core temperature	100°C vs 80°C
Manufacturing process technology	130 nm vs 180 nm
L2 cache	512 KB vs 256 KB
Thermal Design Power (TDP)	12.1 Watt vs 20.8 Watt

Compare benchmarks

CPU 1: Intel Pentium III 1000S
CPU 2: Intel Pentium III 800

Name	Intel Pentium III 1000S	Intel Pentium III 800
PassMark - Single thread mark		237
PassMark - CPU mark		182

Compare specifications (specs)

	Intel Pentium III 1000S	Intel Pentium III 800
Essentials
Architecture codename	Tualatin	Coppermine T
Launch date	June 2001	n/d
Place in performance rating	not rated	3273
Series	Legacy Intel® Pentium® Processor	Legacy Intel® Pentium® Processor
Status	Discontinued	Discontinued
Vertical segment	Server	Desktop
Performance
64 bit support
Base frequency	1.00 GHz	800 MHz
Bus Speed	133 MHz FSB	133 MHz FSB
Die size	80 mm	80 mm
L1 cache	8 KB	8 KB
L2 cache	512 KB	256 KB
Manufacturing process technology	130 nm	180 nm
Maximum case temperature (TCase)	69 °C	69 °C
Maximum core temperature	100°C	80°C
Maximum frequency	1 GHz	0.8 GHz
Number of cores	1	1
Transistor count	44 million	44 million
VID voltage range	1.15V	1.75V
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Sockets supported	H-PBGA479	PPGA370, SECC2, SECC2495
Thermal Design Power (TDP)	12.1 Watt	20.8 Watt
Advanced Technologies
Intel® Turbo Boost technology
Virtualization
Intel® Virtualization Technology (VT-x)