Intel Pentium M 765 vs Intel Celeron D 326
Comparative analysis of Intel Pentium M 765 and Intel Celeron D 326 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory.
Differences
Reasons to consider the Intel Pentium M 765
- CPU is newer: launch date 0 month(s) later
- Around 48% higher maximum core temperature: 100°C vs 67.7°C
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 8x more L2 cache, more data can be stored in the L2 cache for quick access later
- 10.5x lower typical power consumption: 7.5 Watt vs 84 Watt
Launch date | October 2004 vs September 2004 |
Maximum core temperature | 100°C vs 67.7°C |
L1 cache | 32 KB vs 16 KB |
L2 cache | 2048 KB vs 256 KB |
Thermal Design Power (TDP) | 7.5 Watt vs 84 Watt |
Reasons to consider the Intel Celeron D 326
- Around 20% higher clock speed: 2.53 GHz vs 2.1 GHz
Maximum frequency | 2.53 GHz vs 2.1 GHz |
Compare specifications (specs)
Intel Pentium M 765 | Intel Celeron D 326 | |
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Essentials |
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Architecture codename | Dothan | Prescott |
Launch date | October 2004 | September 2004 |
Place in performance rating | not rated | not rated |
Processor Number | 765 | 326 |
Series | Legacy Intel® Pentium® Processor | Legacy Intel® Celeron® Processor |
Status | Discontinued | Discontinued |
Vertical segment | Mobile | Desktop |
Performance |
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64 bit support | ||
Base frequency | 2.10 GHz | 2.53 GHz |
Bus Speed | 400 MHz FSB | 533 MHz FSB |
Die size | 87 mm2 | 112 mm2 |
Front-side bus (FSB) | 400 MHz | |
L1 cache | 32 KB | 16 KB |
L2 cache | 2048 KB | 256 KB |
Manufacturing process technology | 90 nm | 90 nm |
Maximum core temperature | 100°C | 67.7°C |
Maximum frequency | 2.1 GHz | 2.53 GHz |
Number of cores | 1 | 1 |
Number of threads | 1 | |
Transistor count | 144 million | 125 million |
VID voltage range | 0.988-1.356V | 1.250V-1.400V |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 35mm x 35mm | 37.5mm x 37.5mm |
Sockets supported | PPGA478, H-PBGA479 | PLGA775, PLGA478 |
Thermal Design Power (TDP) | 7.5 Watt | 84 Watt |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
FSB parity | ||
Idle States | ||
Intel 64 | ||
Intel® Demand Based Switching | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Physical Address Extensions (PAE) | 32-bit | 32-bit |
Intel® AES New Instructions | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Memory |
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Supported memory types | DDR1, DDR2, DDR3 |