Intel Xeon E3-1105C vs Intel Xeon E3-1125C
Comparative analysis of Intel Xeon E3-1105C and Intel Xeon E3-1125C processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Xeon E3-1105C
- Around 60% lower typical power consumption: 25 Watt vs 40 Watt
Thermal Design Power (TDP) | 25 Watt vs 40 Watt |
Reasons to consider the Intel Xeon E3-1125C
- Around 100% higher clock speed: 2 GHz vs 1 GHz
- Around 33% more L3 cache; more data can be stored in the L3 cache for quick access later
Maximum frequency | 2 GHz vs 1 GHz |
L3 cache | 8192 KB (shared) vs 6144 KB (shared) |
Compare specifications (specs)
Intel Xeon E3-1105C | Intel Xeon E3-1125C | |
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Essentials |
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Architecture codename | Gladden | Gladden |
Launch date | May 2012 | May 2012 |
Place in performance rating | not rated | not rated |
Processor Number | E3-1105C | E3-1125C |
Series | Intel® Xeon® Processor E3 Family | Intel® Xeon® Processor E3 Family |
Status | Launched | Launched |
Vertical segment | Embedded | Embedded |
Performance |
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64 bit support | ||
Base frequency | 1.00 GHz | 2.00 GHz |
Die size | 216 mm | 216 mm |
L1 cache | 64 KB (per core) | 64 KB (per core) |
L2 cache | 256 KB (per core) | 256 KB (per core) |
L3 cache | 6144 KB (shared) | 8192 KB (shared) |
Manufacturing process technology | 32 nm | 32 nm |
Maximum core temperature | 100°C | 100°C |
Maximum frequency | 1 GHz | 2 GHz |
Number of cores | 4 | 4 |
Number of threads | 8 | 8 |
Transistor count | 1160 million | 1160 million |
Memory |
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ECC memory support | ||
Max memory channels | 2 | 2 |
Maximum memory bandwidth | 25.6 GB/s | 25.6 GB/s |
Maximum memory size | 32 GB | 32 GB |
Supported memory types | DDR3 1066/1333/1600 | DDR3 1066/1333/1600 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5 mm | 37.5mm x 37.5 mm |
Sockets supported | FCBGA1284 | FCBGA1284 |
Thermal Design Power (TDP) | 25 Watt | 40 Watt |
Peripherals |
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Max number of PCIe lanes | 20 | 20 |
PCI Express revision | 2 | 2 |
PCIe configurations | 1x16 1x4 or 2x8 1x4 or 1x8 3x4 | 1x16 1x4 or 2x8 1x4 or 1x8 3x4 |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX | Intel® AVX |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |