Intel Xeon E3-1230 v3 vs Intel Xeon W3550
Comparative analysis of Intel Xeon E3-1230 v3 and Intel Xeon W3550 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon E3-1230 v3
- CPU is newer: launch date 3 year(s) 10 month(s) later
- Around 11% higher clock speed: 3.70 GHz vs 3.33 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm
- Around 33% higher maximum memory size: 32 GB vs 24 GB
- Around 63% lower typical power consumption: 80 Watt vs 130 Watt
- Around 48% better performance in PassMark - Single thread mark: 2079 vs 1408
- 2.1x better performance in PassMark - CPU mark: 6807 vs 3209
- Around 58% better performance in Geekbench 4 - Single Core: 865 vs 548
- Around 51% better performance in Geekbench 4 - Multi-Core: 3280 vs 2171
Specifications (specs) | |
Launch date | June 2013 vs August 2009 |
Maximum frequency | 3.70 GHz vs 3.33 GHz |
Manufacturing process technology | 22 nm vs 45 nm |
Maximum memory size | 32 GB vs 24 GB |
Thermal Design Power (TDP) | 80 Watt vs 130 Watt |
Benchmarks | |
PassMark - Single thread mark | 2079 vs 1408 |
PassMark - CPU mark | 6807 vs 3209 |
Geekbench 4 - Single Core | 865 vs 548 |
Geekbench 4 - Multi-Core | 3280 vs 2171 |
Compare benchmarks
CPU 1: Intel Xeon E3-1230 v3
CPU 2: Intel Xeon W3550
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Xeon E3-1230 v3 | Intel Xeon W3550 |
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PassMark - Single thread mark | 2079 | 1408 |
PassMark - CPU mark | 6807 | 3209 |
Geekbench 4 - Single Core | 865 | 548 |
Geekbench 4 - Multi-Core | 3280 | 2171 |
3DMark Fire Strike - Physics Score | 3655 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 4.829 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 83.748 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.585 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.375 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 5.897 |
Compare specifications (specs)
Intel Xeon E3-1230 v3 | Intel Xeon W3550 | |
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Essentials |
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Architecture codename | Haswell | Bloomfield |
Launch date | June 2013 | August 2009 |
Launch price (MSRP) | $264 | $235 |
Place in performance rating | 2071 | 2075 |
Price now | $261.66 | $59.95 |
Processor Number | E3-1230 v3 | W3550 |
Series | Intel® Xeon® Processor E3 v3 Family | Legacy Intel® Xeon® Processors |
Status | Discontinued | Discontinued |
Value for money (0-100) | 10.50 | 27.98 |
Vertical segment | Server | Server |
Performance |
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64 bit support | ||
Base frequency | 3.30 GHz | 3.06 GHz |
Bus Speed | 5 GT/s DMI | 4.8 GT/s QPI |
Die size | 160 mm | 263 mm2 |
L1 cache | 64 KB (per core) | 64 KB (per core) |
L2 cache | 256 KB (per core) | 256 KB (per core) |
L3 cache | 8192 KB (shared) | 8192 KB (shared) |
Manufacturing process technology | 22 nm | 45 nm |
Maximum frequency | 3.70 GHz | 3.33 GHz |
Number of cores | 4 | 4 |
Number of QPI Links | 0 | 1 |
Number of threads | 8 | 8 |
Transistor count | 1400 million | 731 million |
Maximum core temperature | 67.9°C | |
VID voltage range | 0.800V-1.375V | |
Memory |
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ECC memory support | ||
Max memory channels | 2 | 3 |
Maximum memory bandwidth | 25.6 GB/s | 25.6 GB/s |
Maximum memory size | 32 GB | 24 GB |
Supported memory types | DDR3 and DDR3L 1333/1600 at 1.5V | DDR3 800/1066 |
Graphics |
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Processor graphics | None | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 37.5mm x 37.5mm | 42.5mm x 45.0mm |
Sockets supported | FCLGA1150 | FCLGA1366 |
Thermal Design Power (TDP) | 80 Watt | 130 Watt |
Thermal Solution | PCG 2013D | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | |
PCIe configurations | 1x16, 2x8, 1x8/2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | Intel® SSE4.2 |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Intel® Demand Based Switching | ||
Physical Address Extensions (PAE) | 36-bit | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |