Intel Xeon E3-1241 v3 vs Intel Xeon L5609
Comparative analysis of Intel Xeon E3-1241 v3 and Intel Xeon L5609 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon E3-1241 v3
- 4 more threads: 8 vs 4
- Around 110% higher clock speed: 3.90 GHz vs 1.86 GHz
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- Around 87% better performance in PassMark - Single thread mark: 2172 vs 1160
- 2.2x better performance in PassMark - CPU mark: 7140 vs 3298
Specifications (specs) | |
Number of threads | 8 vs 4 |
Maximum frequency | 3.90 GHz vs 1.86 GHz |
Manufacturing process technology | 22 nm vs 32 nm |
Benchmarks | |
PassMark - Single thread mark | 2172 vs 1160 |
PassMark - CPU mark | 7140 vs 3298 |
Reasons to consider the Intel Xeon L5609
- 9x more maximum memory size: 288 GB vs 32 GB
- 2x lower typical power consumption: 40 Watt vs 80 Watt
Maximum memory size | 288 GB vs 32 GB |
Max number of CPUs in a configuration | 2 vs 1 |
Thermal Design Power (TDP) | 40 Watt vs 80 Watt |
Compare benchmarks
CPU 1: Intel Xeon E3-1241 v3
CPU 2: Intel Xeon L5609
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon E3-1241 v3 | Intel Xeon L5609 |
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PassMark - Single thread mark | 2172 | 1160 |
PassMark - CPU mark | 7140 | 3298 |
Geekbench 4 - Single Core | 919 | |
Geekbench 4 - Multi-Core | 3419 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 5.288 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 90.177 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.666 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 2.528 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 6.201 |
Compare specifications (specs)
Intel Xeon E3-1241 v3 | Intel Xeon L5609 | |
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Essentials |
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Architecture codename | Haswell | Westmere EP |
Launch date | Q2'14 | March 2010 |
Place in performance rating | 2045 | 2040 |
Processor Number | E3-1241V3 | L5609 |
Series | Intel® Xeon® Processor E3 v3 Family | Legacy Intel® Xeon® Processors |
Status | Launched | Discontinued |
Vertical segment | Server | Server |
Performance |
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64 bit support | ||
Base frequency | 3.50 GHz | 1.86 GHz |
Bus Speed | 5 GT/s DMI2 | 4.8 GT/s QPI |
Manufacturing process technology | 22 nm | 32 nm |
Maximum frequency | 3.90 GHz | 1.86 GHz |
Number of cores | 4 | 4 |
Number of QPI Links | 0 | 2 |
Number of threads | 8 | 4 |
Die size | 239 mm | |
L1 cache | 64 KB (per core) | |
L2 cache | 256 KB (per core) | |
L3 cache | 12288 KB (shared) | |
Maximum core temperature | 63.1°C | |
Transistor count | 1170 million | |
VID voltage range | 0.750V-1.350V | |
Memory |
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Max memory channels | 2 | 3 |
Maximum memory bandwidth | 25.6 GB/s | 25.6 GB/s |
Maximum memory size | 32 GB | 288 GB |
Supported memory types | DDR3 and DDR3L 1333/1600 at 1.5V | DDR3 800/1066 |
ECC memory support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 2 |
Package Size | 37.5mm x 37.5mm | 42.5mm x 45mm |
Sockets supported | FCLGA1150 | FCLGA1366 |
Thermal Design Power (TDP) | 80 Watt | 40 Watt |
Thermal Solution | PCG 2013D | |
Peripherals |
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Max number of PCIe lanes | 16 | |
PCI Express revision | 3.0 | |
PCIe configurations | 1x16, 2x8, 1x8/2x4 | |
Scalability | 1S Only | |
Security & Reliability |
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Anti-Theft technology | ||
Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | Intel® SSE4.2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Intel® Demand Based Switching | ||
Physical Address Extensions (PAE) | 40-bit | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |