Intel Xeon E3-1284L v3 vs Intel Core i3-2312M

Comparative analysis of Intel Xeon E3-1284L v3 and Intel Core i3-2312M processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Xeon E3-1284L v3

  • CPU is newer: launch date 3 year(s) 0 month(s) later
  • 2 more cores, run more applications at once: 4 vs 2
  • 4 more threads: 8 vs 4
  • Around 52% higher clock speed: 3.20 GHz vs 2.1 GHz
  • Around 18% higher maximum core temperature: 100 °C vs 85 C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
  • 2x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 2x more L2 cache, more data can be stored in the L2 cache for quick access later
  • 2x more L3 cache, more data can be stored in the L3 cache for quick access later
  • 2x more maximum memory size: 32 GB vs 16 GB
Launch date 1 March 2014 vs 20 February 2011
Number of cores 4 vs 2
Number of threads 8 vs 4
Maximum frequency 3.20 GHz vs 2.1 GHz
Maximum core temperature 100 °C vs 85 C
Manufacturing process technology 22 nm vs 32 nm
L1 cache 256 KB vs 128 KB
L2 cache 1 MB vs 512 KB
L3 cache 6 MB vs 3072 KB
Maximum memory size 32 GB vs 16 GB

Reasons to consider the Intel Core i3-2312M

  • Around 34% lower typical power consumption: 35 Watt vs 47 Watt
Thermal Design Power (TDP) 35 Watt vs 47 Watt

Compare benchmarks

CPU 1: Intel Xeon E3-1284L v3
CPU 2: Intel Core i3-2312M

Name Intel Xeon E3-1284L v3 Intel Core i3-2312M
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 11.603
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 90.521
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.673
CompuBench 1.5 Desktop - Video Composition (Frames/s) 15.649
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 25.273
PassMark - Single thread mark 902
PassMark - CPU mark 1159
Geekbench 4 - Single Core 1963
Geekbench 4 - Multi-Core 3645

Compare specifications (specs)

Intel Xeon E3-1284L v3 Intel Core i3-2312M

Essentials

Architecture codename Crystal Well Sandy Bridge
Family Xeon E3
Launch date 1 March 2014 20 February 2011
Launch price (MSRP) $662 $225
Place in performance rating 1687 1683
Processor Number E3-1284L v3 i3-2312M
Vertical segment Embedded Mobile
Series Legacy Intel® Core™ Processors
Status Launched

Performance

64 bit support
Base frequency 1.80 GHz 2.10 GHz
Bus Speed 5 GT/s DMI 5 GT/s DMI
L1 cache 256 KB 128 KB
L2 cache 1 MB 512 KB
L3 cache 6 MB 3072 KB
Manufacturing process technology 22 nm 32 nm
Maximum core temperature 100 °C 85 C
Maximum frequency 3.20 GHz 2.1 GHz
Number of cores 4 2
Number of threads 8 4
Unlocked
Die size 149 mm
Maximum case temperature (TCase) 85 °C
Transistor count 624 Million

Memory

ECC memory support
Max memory channels 2 2
Maximum memory bandwidth 25.6 GB/s 21.3 GB/s
Maximum memory size 32 GB 16 GB
Supported memory types DDR3L 1333/1600 DDR3 1066/1333

Graphics

Graphics base frequency 750 MHz 650 MHz
Graphics max frequency 1.00 GHz 1.1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics Intel Iris Pro Graphics 5200 Intel® HD Graphics 3000
Device ID 0x116
Graphics max dynamic frequency 1.10 GHz

Graphics interfaces

DisplayPort
eDP
HDMI
Number of displays supported 3 2
VGA
CRT
SDVO
Wireless Display (WiDi) support

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 1 1
Sockets supported FCBGA1364 PPGA988
Thermal Design Power (TDP) 47 Watt 35 Watt
Package Size 37.5mm x 37.5mm *rPGA988B);

Peripherals

Max number of PCIe lanes 16 16
PCI Express revision 3.0 2.0
PCIe configurations 1x16, 2x8, 1x8 2x4 1x16, 2x8, 1x8+2x4

Security & Reliability

Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 Intel® AVX
Intel 64
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
4G WiMAX Wireless
Flexible Display interface (FDI)
Intel® Advanced Vector Extensions (AVX)
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® My WiFi technology

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)