Intel Xeon E3-1284L v3 vs Intel Core i3-2312M

Comparative analysis of Intel Xeon E3-1284L v3 and Intel Core i3-2312M processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Xeon E3-1284L v3

Intel Core i3-2312M

Differences

Reasons to consider the Intel Xeon E3-1284L v3

CPU is newer: launch date 3 year(s) 0 month(s) later
2 more cores, run more applications at once: 4 vs 2
4 more threads: 8 vs 4
Around 52% higher clock speed: 3.20 GHz vs 2.1 GHz
Around 18% higher maximum core temperature: 100 °C vs 85 C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
2x more L1 cache, more data can be stored in the L1 cache for quick access later
2x more L2 cache, more data can be stored in the L2 cache for quick access later
2x more L3 cache, more data can be stored in the L3 cache for quick access later
2x more maximum memory size: 32 GB vs 16 GB

Launch date	1 March 2014 vs 20 February 2011
Number of cores	4 vs 2
Number of threads	8 vs 4
Maximum frequency	3.20 GHz vs 2.1 GHz
Maximum core temperature	100 °C vs 85 C
Manufacturing process technology	22 nm vs 32 nm
L1 cache	256 KB vs 128 KB
L2 cache	1 MB vs 512 KB
L3 cache	6 MB vs 3072 KB
Maximum memory size	32 GB vs 16 GB

Reasons to consider the Intel Core i3-2312M

Around 34% lower typical power consumption: 35 Watt vs 47 Watt

Thermal Design Power (TDP)	35 Watt vs 47 Watt

Compare benchmarks

CPU 1: Intel Xeon E3-1284L v3
CPU 2: Intel Core i3-2312M

Name	Intel Xeon E3-1284L v3	Intel Core i3-2312M
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	11.603
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	90.521
CompuBench 1.5 Desktop - T-Rex (Frames/s)	0.673
CompuBench 1.5 Desktop - Video Composition (Frames/s)	15.649
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)	25.273
PassMark - Single thread mark		902
PassMark - CPU mark		1159
Geekbench 4 - Single Core		1963
Geekbench 4 - Multi-Core		3645

Compare specifications (specs)

	Intel Xeon E3-1284L v3	Intel Core i3-2312M
Essentials
Architecture codename	Crystal Well	Sandy Bridge
Family	Xeon E3
Launch date	1 March 2014	20 February 2011
Launch price (MSRP)	$662	$225
Place in performance rating	1685	1681
Processor Number	E3-1284L v3	i3-2312M
Vertical segment	Embedded	Mobile
Series		Legacy Intel® Core™ Processors
Status		Launched
Performance
64 bit support
Base frequency	1.80 GHz	2.10 GHz
Bus Speed	5 GT/s DMI	5 GT/s DMI
L1 cache	256 KB	128 KB
L2 cache	1 MB	512 KB
L3 cache	6 MB	3072 KB
Manufacturing process technology	22 nm	32 nm
Maximum core temperature	100 °C	85 C
Maximum frequency	3.20 GHz	2.1 GHz
Number of cores	4	2
Number of threads	8	4
Unlocked
Die size		149 mm
Maximum case temperature (TCase)		85 °C
Transistor count		624 Million
Memory
ECC memory support
Max memory channels	2	2
Maximum memory bandwidth	25.6 GB/s	21.3 GB/s
Maximum memory size	32 GB	16 GB
Supported memory types	DDR3L 1333/1600	DDR3 1066/1333
Graphics
Graphics base frequency	750 MHz	650 MHz
Graphics max frequency	1.00 GHz	1.1 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics	Intel Iris Pro Graphics 5200	Intel® HD Graphics 3000
Device ID		0x116
Graphics max dynamic frequency		1.10 GHz
Graphics interfaces
DisplayPort
eDP
HDMI
Number of displays supported	3	2
VGA
CRT
SDVO
Wireless Display (WiDi) support
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	1	1
Sockets supported	FCBGA1364	PPGA988
Thermal Design Power (TDP)	47 Watt	35 Watt
Package Size		37.5mm x 37.5mm *rPGA988B);
Peripherals
Max number of PCIe lanes	16	16
PCI Express revision	3.0	2.0
PCIe configurations	1x16, 2x8, 1x8 2x4	1x16, 2x8, 1x8+2x4
Security & Reliability
Anti-Theft technology
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2	Intel® AVX
Intel 64
Intel® Advanced Vector Extensions 2 (AVX2)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Thermal Monitoring
4G WiMAX Wireless
Flexible Display interface (FDI)
Intel® Advanced Vector Extensions (AVX)
Intel® Demand Based Switching
Intel® Fast Memory Access
Intel® Flex Memory Access
Intel® My WiFi technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)