Intel Xeon E3-1505M v5 vs Intel Core i3-2312M
Comparative analysis of Intel Xeon E3-1505M v5 and Intel Core i3-2312M processors for all known characteristics in the following categories: Essentials, Performance, Memory, Graphics, Graphics interfaces, Graphics image quality, Graphics API support, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon E3-1505M v5
- CPU is newer: launch date 4 year(s) 6 month(s) later
- 2 more cores, run more applications at once: 4 vs 2
- 4 more threads: 8 vs 4
- Around 76% higher clock speed: 3.70 GHz vs 2.1 GHz
- Around 18% higher maximum core temperature: 100°C vs 85 C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 32 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2.7x more L3 cache, more data can be stored in the L3 cache for quick access later
- 4x more maximum memory size: 64 GB vs 16 GB
- 2.2x better performance in PassMark - Single thread mark: 2001 vs 925
- 5.9x better performance in PassMark - CPU mark: 6947 vs 1171
Specifications (specs) | |
Launch date | 1 September 2015 vs 20 February 2011 |
Number of cores | 4 vs 2 |
Number of threads | 8 vs 4 |
Maximum frequency | 3.70 GHz vs 2.1 GHz |
Maximum core temperature | 100°C vs 85 C |
Manufacturing process technology | 14 nm vs 32 nm |
L1 cache | 256 KB vs 128 KB |
L2 cache | 1 MB vs 512 KB |
L3 cache | 8 MB vs 3072 KB |
Maximum memory size | 64 GB vs 16 GB |
Benchmarks | |
PassMark - Single thread mark | 2001 vs 925 |
PassMark - CPU mark | 6947 vs 1171 |
Reasons to consider the Intel Core i3-2312M
- Around 29% lower typical power consumption: 35 Watt vs 45 Watt
- 2.3x better performance in Geekbench 4 - Single Core: 1963 vs 855
- Around 11% better performance in Geekbench 4 - Multi-Core: 3645 vs 3270
Specifications (specs) | |
Thermal Design Power (TDP) | 35 Watt vs 45 Watt |
Benchmarks | |
Geekbench 4 - Single Core | 1963 vs 855 |
Geekbench 4 - Multi-Core | 3645 vs 3270 |
Compare benchmarks
CPU 1: Intel Xeon E3-1505M v5
CPU 2: Intel Core i3-2312M
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Xeon E3-1505M v5 | Intel Core i3-2312M |
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PassMark - Single thread mark | 2001 | 925 |
PassMark - CPU mark | 6947 | 1171 |
Geekbench 4 - Single Core | 855 | 1963 |
Geekbench 4 - Multi-Core | 3270 | 3645 |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 16.28 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 132.581 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.724 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 5.227 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 40.563 |
Compare specifications (specs)
Intel Xeon E3-1505M v5 | Intel Core i3-2312M | |
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Essentials |
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Architecture codename | Skylake | Sandy Bridge |
Launch date | 1 September 2015 | 20 February 2011 |
Place in performance rating | 1586 | 1591 |
Processor Number | E3-1505MV5 | i3-2312M |
Series | Intel® Xeon® Processor E3 v5 Family | Legacy Intel® Core™ Processors |
Status | Launched | Launched |
Vertical segment | Mobile | Mobile |
Launch price (MSRP) | $225 | |
Performance |
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64 bit support | ||
Base frequency | 2.80 GHz | 2.10 GHz |
Bus Speed | 8 GT/s DMI3 | 5 GT/s DMI |
Die size | 122 mm | 149 mm |
L1 cache | 256 KB | 128 KB |
L2 cache | 1 MB | 512 KB |
L3 cache | 8 MB | 3072 KB |
Manufacturing process technology | 14 nm | 32 nm |
Maximum core temperature | 100°C | 85 C |
Maximum frequency | 3.70 GHz | 2.1 GHz |
Number of cores | 4 | 2 |
Number of threads | 8 | 4 |
Maximum case temperature (TCase) | 85 °C | |
Transistor count | 624 Million | |
Memory |
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ECC memory support | ||
Max memory channels | 2 | 2 |
Maximum memory bandwidth | 34.1 GB/s | 21.3 GB/s |
Maximum memory size | 64 GB | 16 GB |
Supported memory types | DDR4-2133, LPDDR3-1866, DDR3L-1600 | DDR3 1066/1333 |
Graphics |
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Device ID | 0x191D | 0x116 |
Graphics base frequency | 350 MHz | 650 MHz |
Graphics max dynamic frequency | 1.05 GHz | 1.10 GHz |
Graphics max frequency | 1.05 GHz | 1.1 GHz |
Intel® Clear Video HD technology | ||
Intel® Clear Video technology | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Max video memory | 1.7 GB | |
Processor graphics | Intel® HD Graphics P530 | Intel® HD Graphics 3000 |
Intel® Flexible Display Interface (Intel® FDI) | ||
Graphics interfaces |
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DisplayPort | ||
DVI | ||
eDP | ||
HDMI | ||
Number of displays supported | 3 | 2 |
Wireless Display (WiDi) support | ||
CRT | ||
SDVO | ||
Graphics image quality |
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4K resolution support | ||
Max resolution over DisplayPort | 4096x2304@60Hz | |
Max resolution over eDP | 4096x2304@60Hz | |
Max resolution over HDMI 1.4 | 4096x2304@24Hz | |
Max resolution over VGA | N / A | |
Max resolution over WiDi | 1080p | |
Graphics API support |
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DirectX | 12 | |
OpenGL | 4.4 | |
Compatibility |
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Configurable TDP-down | 35 W | |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 42mm x 28mm | 37.5mm x 37.5mm *rPGA988B); |
Sockets supported | FCBGA1440 | PPGA988 |
Thermal Design Power (TDP) | 45 Watt | 35 Watt |
Peripherals |
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Max number of PCIe lanes | 16 | 16 |
PCI Express revision | 3.0 | 2.0 |
PCIe configurations | Up to 1x16, 2x8, 1x8+2x4 | 1x16, 2x8, 1x8+2x4 |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Memory Protection Extensions (Intel® MPX) | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Software Guard Extensions (Intel® SGX) | ||
Intel® Trusted Execution technology (TXT) | ||
Anti-Theft technology | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 | Intel® AVX |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® My WiFi technology | ||
Intel® Smart Response technology | ||
Intel® Stable Image Platform Program (SIPP) | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
4G WiMAX Wireless | ||
Flexible Display interface (FDI) | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Virtualization |
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AMD Virtualization (AMD-V™) | ||
Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |