Intel Xeon E5-1650 v2 vs AMD Opteron 3350 HE
Comparative analysis of Intel Xeon E5-1650 v2 and AMD Opteron 3350 HE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon E5-1650 v2
- 2 more cores, run more applications at once: 6 vs 4
- 8 more threads: 12 vs 4
- Around 3% higher clock speed: 3.90 GHz vs 3.8 GHz
- Around 1% higher maximum core temperature: 70°C vs 69.10°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- Around 50% more L3 cache; more data can be stored in the L3 cache for quick access later
- Around 62% better performance in PassMark - Single thread mark: 2052 vs 1263
- 2.3x better performance in PassMark - CPU mark: 9324 vs 4009
Specifications (specs) | |
Number of cores | 6 vs 4 |
Number of threads | 12 vs 4 |
Maximum frequency | 3.90 GHz vs 3.8 GHz |
Maximum core temperature | 70°C vs 69.10°C |
Manufacturing process technology | 22 nm vs 32 nm |
L1 cache | 64 KB (per core) vs 192 KB |
L3 cache | 12288 KB (shared) vs 8 MB |
Benchmarks | |
PassMark - Single thread mark | 2052 vs 1263 |
PassMark - CPU mark | 9324 vs 4009 |
Reasons to consider the AMD Opteron 3350 HE
- 2.7x more L2 cache, more data can be stored in the L2 cache for quick access later
- 2.9x lower typical power consumption: 45 Watt vs 130 Watt
L2 cache | 4 MB vs 256 KB (per core) |
Thermal Design Power (TDP) | 45 Watt vs 130 Watt |
Compare benchmarks
CPU 1: Intel Xeon E5-1650 v2
CPU 2: AMD Opteron 3350 HE
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon E5-1650 v2 | AMD Opteron 3350 HE |
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PassMark - Single thread mark | 2052 | 1263 |
PassMark - CPU mark | 9324 | 4009 |
Geekbench 4 - Single Core | 783 | |
Geekbench 4 - Multi-Core | 4838 | |
3DMark Fire Strike - Physics Score | 5795 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 7.106 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 67.646 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.842 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 3.4 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 8.992 |
Compare specifications (specs)
Intel Xeon E5-1650 v2 | AMD Opteron 3350 HE | |
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Essentials |
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Architecture codename | Ivy Bridge EP | Delhi |
Launch date | September 2013 | n/d |
Launch price (MSRP) | $917 | |
Place in performance rating | 1888 | 1912 |
Price now | $644.95 | |
Processor Number | E5-1650V2 | |
Series | Intel® Xeon® Processor E5 v2 Family | AMD Opteron 3300 Series Processor |
Status | Launched | |
Value for money (0-100) | 5.81 | |
Vertical segment | Server | Server |
Family | AMD Opteron | |
OPN Tray | OS3350HOW4KHK | |
Performance |
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64 bit support | ||
Base frequency | 3.50 GHz | 2.8 GHz |
Bus Speed | 0 GT/s QPI | |
Die size | 160 mm | 315 mm |
L1 cache | 64 KB (per core) | 192 KB |
L2 cache | 256 KB (per core) | 4 MB |
L3 cache | 12288 KB (shared) | 8 MB |
Manufacturing process technology | 22 nm | 32 nm |
Maximum core temperature | 70°C | 69.10°C |
Maximum frequency | 3.90 GHz | 3.8 GHz |
Number of cores | 6 | 4 |
Number of QPI Links | 0 | |
Number of threads | 12 | 4 |
Transistor count | 1400 million | 1200 million |
VID voltage range | 0.65–1.30V | |
Unlocked | ||
Memory |
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ECC memory support | ||
Max memory channels | 4 | |
Maximum memory bandwidth | 59.7 GB/s | |
Maximum memory size | 256 GB | |
Supported memory types | DDR3 800/1066/1333/1600/1866 | DDR3 |
Supported memory frequency | 2000 MHz | |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | 1 |
Package Size | 52.5mm x 45.0 mm | |
Sockets supported | FCLGA2011 | AM3+ |
Thermal Design Power (TDP) | 130 Watt | 45 Watt |
Peripherals |
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Max number of PCIe lanes | 40 | |
PCI Express revision | 3.0 | |
PCIe configurations | x4, x8, x16 | |
Scalability | 1S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Fused Multiply-Add (FMA) | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
AMD Virtualization (AMD-V™) |