Intel Xeon E5-2608L v3 vs Intel Core m3-7Y30

Comparative analysis of Intel Xeon E5-2608L v3 and Intel Core m3-7Y30 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Graphics image quality, Graphics API support. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).

Intel Xeon E5-2608L v3

Intel Core m3-7Y30

Differences

Reasons to consider the Intel Xeon E5-2608L v3

4 more cores, run more applications at once: 6 vs 2
8 more threads: 12 vs 4
48x more maximum memory size: 768 GB vs 16 GB
2.5x better performance in PassMark - CPU mark: 6415 vs 2585

Specifications (specs)
Number of cores	6 vs 2
Number of threads	12 vs 4
Maximum memory size	768 GB vs 16 GB
Max number of CPUs in a configuration	2 vs 1
Benchmarks
PassMark - CPU mark	6415 vs 2585

Reasons to consider the Intel Core m3-7Y30

Around 13% higher maximum core temperature: 100°C vs 88.84°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
10.4x lower typical power consumption: 4.5 Watt vs 52 Watt
Around 16% better performance in PassMark - Single thread mark: 1405 vs 1210

Specifications (specs)
Maximum core temperature	100°C vs 88.84°C
Manufacturing process technology	14 nm vs 22 nm
Thermal Design Power (TDP)	4.5 Watt vs 52 Watt
Benchmarks
PassMark - Single thread mark	1405 vs 1210

Compare benchmarks

CPU 1: Intel Xeon E5-2608L v3
CPU 2: Intel Core m3-7Y30

PassMark - Single thread mark

CPU 1

CPU 2

1210

1405

PassMark - CPU mark

CPU 1

CPU 2

6415

2585

Name	Intel Xeon E5-2608L v3	Intel Core m3-7Y30
PassMark - Single thread mark	1210	1405
PassMark - CPU mark	6415	2585
Geekbench 4 - Single Core		2762
Geekbench 4 - Multi-Core		5338
CompuBench 1.5 Desktop - Face Detection (mPixels/s)		6.689
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)		29.007
CompuBench 1.5 Desktop - T-Rex (Frames/s)		0.213
CompuBench 1.5 Desktop - Video Composition (Frames/s)		1.308
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)		14.871
GFXBench 4.0 - Car Chase Offscreen (Frames)		1357
GFXBench 4.0 - Manhattan (Frames)		1183
GFXBench 4.0 - T-Rex (Frames)		2190
GFXBench 4.0 - Car Chase Offscreen (Fps)		1357
GFXBench 4.0 - Manhattan (Fps)		1183
GFXBench 4.0 - T-Rex (Fps)		2190

Compare specifications (specs)

	Intel Xeon E5-2608L v3	Intel Core m3-7Y30
Essentials
Architecture codename	Haswell	Kaby Lake
Launch date	Q3'14	30 August 2016
Place in performance rating	1873	1868
Processor Number	E5-2608LV3	M3-7Y30
Series	Intel® Xeon® Processor E5 v3 Family	7th Generation Intel® Core™ m Processors
Status	Launched	Launched
Vertical segment	Embedded	Mobile
Launch price (MSRP)		$281
Performance
64 bit support
Base frequency	2.00 GHz	1.00 GHz
Bus Speed	6.4 GT/s QPI	4 GT/s OPI
Manufacturing process technology	22 nm	14 nm
Maximum core temperature	88.84°C	100°C
Number of cores	6	2
Number of QPI Links	2
Number of threads	12	4
VID voltage range	0.65V–1.30V
L1 cache		128 KB
L2 cache		512 KB
L3 cache		4 MB
Maximum frequency		2.60 GHz
Memory
Max memory channels	4	2
Maximum memory bandwidth	59 GB/s	29.8 GB/s
Maximum memory size	768 GB	16 GB
Supported memory types	DDR4 1600/1866	LPDDR3-1866, DDR3L-1600
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	2	1
Package Size	52.5mm x 45mm	20.5mm X 16.5mm
Sockets supported	FCLGA2011-3	FCBGA1515
Thermal Design Power (TDP)	52 Watt	4.5 Watt
Configurable TDP-down		3.75 W
Configurable TDP-down Frequency		600 MHz
Configurable TDP-up		7 W
Configurable TDP-up Frequency		1.60 GHz
Peripherals
Max number of PCIe lanes	40	10
PCI Express revision	3.0	3.0
PCIe configurations	x4, x8, x16	1x4, 2x2, 1x2+2x1 and 4x1
Scalability	2S
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Intel® Memory Protection Extensions (Intel® MPX)
Intel® Software Guard Extensions (Intel® SGX)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® AVX2	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)	46-bit
Thermal Monitoring
Intel® Advanced Vector Extensions (AVX)
Intel® My WiFi technology
Intel® Smart Response technology
Intel® Stable Image Platform Program (SIPP)
Speed Shift technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)
Graphics
Device ID		0x591E
Graphics base frequency		300 MHz
Graphics max dynamic frequency		900 MHz
Graphics max frequency		900 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory		16 GB
Processor graphics		Intel® HD Graphics 615
Graphics interfaces
DisplayPort
DVI
eDP
HDMI
Number of displays supported		3
Graphics image quality
4K resolution support
Max resolution over DisplayPort		3840x2160@60Hz
Max resolution over eDP		3840x2160@60Hz
Max resolution over HDMI 1.4		4096x2304@24Hz
Graphics API support
DirectX		12
OpenGL		4.5