Intel Xeon E5-2608L v3 vs Intel Core m3-7Y30

Comparative analysis of Intel Xeon E5-2608L v3 and Intel Core m3-7Y30 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics, Graphics interfaces, Graphics image quality, Graphics API support. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), GFXBench 4.0 - Car Chase Offscreen (Frames), GFXBench 4.0 - Manhattan (Frames), GFXBench 4.0 - T-Rex (Frames), GFXBench 4.0 - Car Chase Offscreen (Fps), GFXBench 4.0 - Manhattan (Fps), GFXBench 4.0 - T-Rex (Fps).

 

Differences

Reasons to consider the Intel Xeon E5-2608L v3

  • 4 more cores, run more applications at once: 6 vs 2
  • 8 more threads: 12 vs 4
  • 48x more maximum memory size: 768 GB vs 16 GB
  • 2.5x better performance in PassMark - CPU mark: 6415 vs 2585
Specifications (specs)
Number of cores 6 vs 2
Number of threads 12 vs 4
Maximum memory size 768 GB vs 16 GB
Max number of CPUs in a configuration 2 vs 1
Benchmarks
PassMark - CPU mark 6415 vs 2585

Reasons to consider the Intel Core m3-7Y30

  • Around 13% higher maximum core temperature: 100°C vs 88.84°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
  • 10.4x lower typical power consumption: 4.5 Watt vs 52 Watt
  • Around 16% better performance in PassMark - Single thread mark: 1405 vs 1210
Specifications (specs)
Maximum core temperature 100°C vs 88.84°C
Manufacturing process technology 14 nm vs 22 nm
Thermal Design Power (TDP) 4.5 Watt vs 52 Watt
Benchmarks
PassMark - Single thread mark 1405 vs 1210

Compare benchmarks

CPU 1: Intel Xeon E5-2608L v3
CPU 2: Intel Core m3-7Y30

PassMark - Single thread mark
CPU 1
CPU 2
1210
1405
PassMark - CPU mark
CPU 1
CPU 2
6415
2585
Name Intel Xeon E5-2608L v3 Intel Core m3-7Y30
PassMark - Single thread mark 1210 1405
PassMark - CPU mark 6415 2585
Geekbench 4 - Single Core 2762
Geekbench 4 - Multi-Core 5338
CompuBench 1.5 Desktop - Face Detection (mPixels/s) 6.689
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) 29.007
CompuBench 1.5 Desktop - T-Rex (Frames/s) 0.213
CompuBench 1.5 Desktop - Video Composition (Frames/s) 1.308
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) 14.871
GFXBench 4.0 - Car Chase Offscreen (Frames) 1357
GFXBench 4.0 - Manhattan (Frames) 1183
GFXBench 4.0 - T-Rex (Frames) 2190
GFXBench 4.0 - Car Chase Offscreen (Fps) 1357
GFXBench 4.0 - Manhattan (Fps) 1183
GFXBench 4.0 - T-Rex (Fps) 2190

Compare specifications (specs)

Intel Xeon E5-2608L v3 Intel Core m3-7Y30

Essentials

Architecture codename Haswell Kaby Lake
Launch date Q3'14 30 August 2016
Place in performance rating 1872 1867
Processor Number E5-2608LV3 M3-7Y30
Series Intel® Xeon® Processor E5 v3 Family 7th Generation Intel® Core™ m Processors
Status Launched Launched
Vertical segment Embedded Mobile
Launch price (MSRP) $281

Performance

64 bit support
Base frequency 2.00 GHz 1.00 GHz
Bus Speed 6.4 GT/s QPI 4 GT/s OPI
Manufacturing process technology 22 nm 14 nm
Maximum core temperature 88.84°C 100°C
Number of cores 6 2
Number of QPI Links 2
Number of threads 12 4
VID voltage range 0.65V–1.30V
L1 cache 128 KB
L2 cache 512 KB
L3 cache 4 MB
Maximum frequency 2.60 GHz

Memory

Max memory channels 4 2
Maximum memory bandwidth 59 GB/s 29.8 GB/s
Maximum memory size 768 GB 16 GB
Supported memory types DDR4 1600/1866 LPDDR3-1866, DDR3L-1600

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 2 1
Package Size 52.5mm x 45mm 20.5mm X 16.5mm
Sockets supported FCLGA2011-3 FCBGA1515
Thermal Design Power (TDP) 52 Watt 4.5 Watt
Configurable TDP-down 3.75 W
Configurable TDP-down Frequency 600 MHz
Configurable TDP-up 7 W
Configurable TDP-up Frequency 1.60 GHz

Peripherals

Max number of PCIe lanes 40 10
PCI Express revision 3.0 3.0
PCIe configurations x4, x8, x16 1x4, 2x2, 1x2+2x1 and 4x1
Scalability 2S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Intel® Memory Protection Extensions (Intel® MPX)
Intel® Software Guard Extensions (Intel® SGX)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX2 Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 46-bit
Thermal Monitoring
Intel® Advanced Vector Extensions (AVX)
Intel® My WiFi technology
Intel® Smart Response technology
Intel® Stable Image Platform Program (SIPP)
Speed Shift technology

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
AMD Virtualization (AMD-V™)

Graphics

Device ID 0x591E
Graphics base frequency 300 MHz
Graphics max dynamic frequency 900 MHz
Graphics max frequency 900 MHz
Intel® Clear Video HD technology
Intel® Clear Video technology
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Max video memory 16 GB
Processor graphics Intel® HD Graphics 615

Graphics interfaces

DisplayPort
DVI
eDP
HDMI
Number of displays supported 3

Graphics image quality

4K resolution support
Max resolution over DisplayPort 3840x2160@60Hz
Max resolution over eDP 3840x2160@60Hz
Max resolution over HDMI 1.4 4096x2304@24Hz

Graphics API support

DirectX 12
OpenGL 4.5