Intel Xeon E5-2608L v4 vs Intel Pentium 4 HT 660

Comparative analysis of Intel Xeon E5-2608L v4 and Intel Pentium 4 HT 660 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

 

Differences

Reasons to consider the Intel Xeon E5-2608L v4

  • 7 more cores, run more applications at once: 8 vs 1
  • Around 33% higher maximum core temperature: 94°C vs 70.8°C
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 90 nm
  • 2.3x lower typical power consumption: 50 Watt vs 115 Watt
Number of cores 8 vs 1
Maximum core temperature 94°C vs 70.8°C
Manufacturing process technology 14 nm vs 90 nm
Max number of CPUs in a configuration 2 vs 1
Thermal Design Power (TDP) 50 Watt vs 115 Watt

Reasons to consider the Intel Pentium 4 HT 660

  • Around 112% higher clock speed: 3.6 GHz vs 1.70 GHz
Maximum frequency 3.6 GHz vs 1.70 GHz

Compare benchmarks

CPU 1: Intel Xeon E5-2608L v4
CPU 2: Intel Pentium 4 HT 660

Name Intel Xeon E5-2608L v4 Intel Pentium 4 HT 660
PassMark - Single thread mark 1092
PassMark - CPU mark 7447
Geekbench 4 - Single Core 975
Geekbench 4 - Multi-Core 1106

Compare specifications (specs)

Intel Xeon E5-2608L v4 Intel Pentium 4 HT 660

Essentials

Architecture codename Broadwell Prescott
Launch date Q1'16 February 2005
Place in performance rating 1998 2291
Processor Number E5-2608LV4 660
Series Intel® Xeon® Processor E5 v4 Family Legacy Intel® Pentium® Processor
Status Launched Discontinued
Vertical segment Embedded Desktop

Performance

64 bit support
Base frequency 1.60 GHz 3.60 GHz
Bus Speed 6.4 GT/s QPI 800 MHz FSB
Manufacturing process technology 14 nm 90 nm
Maximum core temperature 94°C 70.8°C
Maximum frequency 1.70 GHz 3.6 GHz
Number of cores 8 1
Number of QPI Links 2
Number of threads 16
VID voltage range 0 1.200V-1.400V
Die size 135 mm2
L1 cache 28 KB
L2 cache 2048 KB
Transistor count 169 million

Memory

Max memory channels 4
Maximum memory bandwidth 59.7 GB/s
Maximum memory size 1.5 TB
Supported memory types DDR4 1600/1866 DDR1, DDR2, DDR3

Compatibility

Low Halogen Options Available
Max number of CPUs in a configuration 2 1
Package Size 45mm x 52.5mm 37.5mm x 37.5mm
Sockets supported FCLGA2011-3 PLGA775, PPGA775
Thermal Design Power (TDP) 50 Watt 115 Watt

Peripherals

Max number of PCIe lanes 40
PCI Express revision 3.0
PCIe configurations x4, x8, x16
Scalability 2S

Security & Reliability

Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions Intel® AVX2
Intel 64
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE) 46-bit
Thermal Monitoring
FSB parity

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)