Intel Xeon E5-2609 v3 vs Intel Xeon E3-1280
Comparative analysis of Intel Xeon E5-2609 v3 and Intel Xeon E3-1280 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s), CompuBench 1.5 Desktop - Face Detection (mPixels/s).
Differences
Reasons to consider the Intel Xeon E5-2609 v3
- 2 more cores, run more applications at once: 6 vs 4
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
- 24x more maximum memory size: 768 GB vs 32 GB
- Around 12% lower typical power consumption: 85 Watt vs 95 Watt
- Around 53% better performance in PassMark - CPU mark: 8595 vs 5623
- 3x better performance in Geekbench 4 - Single Core: 2216 vs 734
- 3.4x better performance in Geekbench 4 - Multi-Core: 9427 vs 2751
Specifications (specs) | |
Number of cores | 6 vs 4 |
Manufacturing process technology | 22 nm vs 32 nm |
Maximum memory size | 768 GB vs 32 GB |
Max number of CPUs in a configuration | 2 vs 1 |
Thermal Design Power (TDP) | 85 Watt vs 95 Watt |
Benchmarks | |
PassMark - CPU mark | 8595 vs 5623 |
Geekbench 4 - Single Core | 2216 vs 734 |
Geekbench 4 - Multi-Core | 9427 vs 2751 |
Reasons to consider the Intel Xeon E3-1280
- 2 more threads: 8 vs 6
- Around 4% higher maximum core temperature: 73.6°C vs 70.9°C
- Around 63% better performance in PassMark - Single thread mark: 1806 vs 1110
Specifications (specs) | |
Number of threads | 8 vs 6 |
Maximum core temperature | 73.6°C vs 70.9°C |
Benchmarks | |
PassMark - Single thread mark | 1806 vs 1110 |
Compare benchmarks
CPU 1: Intel Xeon E5-2609 v3
CPU 2: Intel Xeon E3-1280
PassMark - Single thread mark |
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PassMark - CPU mark |
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Geekbench 4 - Single Core |
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Geekbench 4 - Multi-Core |
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Name | Intel Xeon E5-2609 v3 | Intel Xeon E3-1280 |
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PassMark - Single thread mark | 1110 | 1806 |
PassMark - CPU mark | 8595 | 5623 |
Geekbench 4 - Single Core | 2216 | 734 |
Geekbench 4 - Multi-Core | 9427 | 2751 |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 32.12 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.279 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 3.17 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 31.866 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 10.42 |
Compare specifications (specs)
Intel Xeon E5-2609 v3 | Intel Xeon E3-1280 | |
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Essentials |
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Architecture codename | Haswell | Sandy Bridge |
Launch date | Q3'14 | April 2011 |
Place in performance rating | 1786 | 1777 |
Processor Number | E5-2609V3 | E3-1280 |
Series | Intel® Xeon® Processor E5 v3 Family | Intel® Xeon® Processor E3 Family |
Status | Discontinued | Discontinued |
Vertical segment | Server | Server |
Launch price (MSRP) | $450 | |
Price now | $368 | |
Value for money (0-100) | 6.78 | |
Performance |
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64 bit support | ||
Base frequency | 1.90 GHz | 3.50 GHz |
Bus Speed | 6.4 GT/s QPI | 5 GT/s DMI |
Manufacturing process technology | 22 nm | 32 nm |
Maximum core temperature | 70.9°C | 73.6°C |
Number of cores | 6 | 4 |
Number of QPI Links | 2 | |
Number of threads | 6 | 8 |
VID voltage range | 0.65V–1.30V | |
Die size | 216 mm | |
L1 cache | 64 KB (per core) | |
L2 cache | 256 KB (per core) | |
L3 cache | 8192 KB (shared) | |
Maximum frequency | 3.90 GHz | |
Transistor count | 1160 million | |
Memory |
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Max memory channels | 4 | 2 |
Maximum memory bandwidth | 51 GB/s | 21 GB/s |
Maximum memory size | 768 GB | 32 GB |
Supported memory types | DDR4 1600 | DDR3 1066/1333 |
ECC memory support | ||
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 2 | 1 |
Package Size | 52.5mm x 45mm | 37.5mm x 37.5mm |
Sockets supported | FCLGA2011-3 | LGA1155 |
Thermal Design Power (TDP) | 85 Watt | 95 Watt |
Peripherals |
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Max number of PCIe lanes | 40 | 20 |
PCI Express revision | 3.0 | 2.0 |
PCIe configurations | x4, x8, x16 | |
Scalability | 2S | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX2 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Physical Address Extensions (PAE) | 46-bit | |
Thermal Monitoring | ||
Flexible Display interface (FDI) | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Fast Memory Access | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics |
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Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Graphics interfaces |
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Wireless Display (WiDi) support |