Intel Xeon E5-2651 v2 vs AMD Opteron 3350 HE

Comparative analysis of Intel Xeon E5-2651 v2 and AMD Opteron 3350 HE processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, PassMark - Single thread mark, PassMark - CPU mark.

 

Differences

Reasons to consider the Intel Xeon E5-2651 v2

  • 8 more cores, run more applications at once: 12 vs 4
  • 20 more threads: 24 vs 4
  • A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
  • 4x more L1 cache, more data can be stored in the L1 cache for quick access later
  • 3.8x more L3 cache, more data can be stored in the L3 cache for quick access later
Number of cores 12 vs 4
Number of threads 24 vs 4
Manufacturing process technology 22 nm vs 32 nm
L1 cache 768 KB vs 192 KB
L3 cache 30 MB vs 8 MB
Max number of CPUs in a configuration 2 vs 1

Reasons to consider the AMD Opteron 3350 HE

  • Around 33% more L2 cache; more data can be stored in the L2 cache for quick access later
L2 cache 4 MB vs 3 MB

Compare benchmarks

CPU 1: Intel Xeon E5-2651 v2
CPU 2: AMD Opteron 3350 HE

Name Intel Xeon E5-2651 v2 AMD Opteron 3350 HE
Geekbench 4 - Single Core 2030
Geekbench 4 - Multi-Core 18071
PassMark - Single thread mark 1263
PassMark - CPU mark 4009

Compare specifications (specs)

Intel Xeon E5-2651 v2 AMD Opteron 3350 HE

Essentials

Architecture codename Ivy Bridge-EP Delhi
Family Intel Xeon E5-2600 v2 AMD Opteron
Launch date November 2013 n/d
Place in performance rating 171 703
Processor Number E5-2651 v2
Vertical segment Server Server
OPN Tray OS3350HOW4KHK
Series AMD Opteron 3300 Series Processor

Performance

64 bit support
Base frequency 1800 MHz 2.8 GHz
Bus Speed 5 GT/s DMI
L1 cache 768 KB 192 KB
L2 cache 3 MB 4 MB
L3 cache 30 MB 8 MB
Manufacturing process technology 22 nm 32 nm
Number of cores 12 4
Number of threads 24 4
Die size 315 mm
Maximum core temperature 69.10°C
Maximum frequency 3.8 GHz
Transistor count 1200 million
Unlocked

Memory

ECC memory support
Max memory channels 4
Maximum memory size 768 GB (per socket)
Supported memory types DDR3 DDR3
Supported memory frequency 2000 MHz

Compatibility

Max number of CPUs in a configuration 2 1
Sockets supported LGA2011 AM3+
Thermal Design Power (TDP) 45 Watt

Peripherals

PCI Express revision 3.0

Security & Reliability

Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)

Advanced Technologies

Enhanced Intel SpeedStep® technology
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Fused Multiply-Add (FMA)

Virtualization

Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
AMD Virtualization (AMD-V™)