Intel Xeon E5-2670 vs Intel Xeon L5506
Comparative analysis of Intel Xeon E5-2670 and Intel Xeon L5506 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon E5-2670
- CPU is newer: launch date 3 year(s) 0 month(s) later
- 4 more cores, run more applications at once: 8 vs 4
- 12 more threads: 16 vs 4
- Around 55% higher clock speed: 3.30 GHz vs 2.13 GHz
- Around 14% higher maximum core temperature: 80.0°C vs 70°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- 2x more L1 cache, more data can be stored in the L1 cache for quick access later
- 2x more L2 cache, more data can be stored in the L2 cache for quick access later
- 5x more L3 cache, more data can be stored in the L3 cache for quick access later
- 2.7x more maximum memory size: 384 GB vs 144 GB
- Around 54% better performance in PassMark - Single thread mark: 1489 vs 967
- 3.9x better performance in PassMark - CPU mark: 15544 vs 4019
Specifications (specs) | |
Launch date | March 2012 vs March 2009 |
Number of cores | 8 vs 4 |
Number of threads | 16 vs 4 |
Maximum frequency | 3.30 GHz vs 2.13 GHz |
Maximum core temperature | 80.0°C vs 70°C |
Manufacturing process technology | 32 nm vs 45 nm |
L1 cache | 64 KB (per core) vs 64 KB (per core) |
L2 cache | 256 KB (per core) vs 256 KB (per core) |
L3 cache | 20480 KB (shared) vs 4096 KB (shared) |
Maximum memory size | 384 GB vs 144 GB |
Benchmarks | |
PassMark - Single thread mark | 1489 vs 967 |
PassMark - CPU mark | 15544 vs 4019 |
Reasons to consider the Intel Xeon L5506
- Around 92% lower typical power consumption: 60 Watt vs 115 Watt
Thermal Design Power (TDP) | 60 Watt vs 115 Watt |
Compare benchmarks
CPU 1: Intel Xeon E5-2670
CPU 2: Intel Xeon L5506
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon E5-2670 | Intel Xeon L5506 |
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PassMark - Single thread mark | 1489 | 967 |
PassMark - CPU mark | 15544 | 4019 |
Geekbench 4 - Single Core | 602 | |
Geekbench 4 - Multi-Core | 4635 | |
3DMark Fire Strike - Physics Score | 0 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 7.119 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 88.939 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.885 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 3.609 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 8.475 |
Compare specifications (specs)
Intel Xeon E5-2670 | Intel Xeon L5506 | |
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Essentials |
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Architecture codename | Sandy Bridge EP | Nehalem EP |
Launch date | March 2012 | March 2009 |
Launch price (MSRP) | $145 | $125 |
Place in performance rating | 2206 | 2233 |
Price now | $96.48 | $224 |
Processor Number | E5-2670 | L5506 |
Series | Intel® Xeon® Processor E5 Family | Legacy Intel® Xeon® Processors |
Status | Discontinued | Launched |
Value for money (0-100) | 37.05 | 4.88 |
Vertical segment | Server | Server |
Performance |
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64 bit support | ||
Base frequency | 2.60 GHz | 2.13 GHz |
Bus Speed | 8 GT/s QPI | 4.8 GT/s QPI |
Die size | 435 mm | 263 mm |
L1 cache | 64 KB (per core) | 64 KB (per core) |
L2 cache | 256 KB (per core) | 256 KB (per core) |
L3 cache | 20480 KB (shared) | 4096 KB (shared) |
Manufacturing process technology | 32 nm | 45 nm |
Maximum core temperature | 80.0°C | 70°C |
Maximum frequency | 3.30 GHz | 2.13 GHz |
Number of cores | 8 | 4 |
Number of QPI Links | 2 | 2 |
Number of threads | 16 | 4 |
Transistor count | 2270 million | 731 million |
VID voltage range | 0.60V-1.35V | 0.75V -1.35V |
Memory |
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ECC memory support | ||
Max memory channels | 4 | 3 |
Maximum memory bandwidth | 51.2 GB/s | 19.2 GB/s |
Maximum memory size | 384 GB | 144 GB |
Supported memory types | DDR3 800/1066/1333/1600 | DDR3 800 |
Compatibility |
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Low Halogen Options Available | ||
Max number of CPUs in a configuration | 2 | 2 |
Package Size | 52.5mm x 45.0mm | 42.5mm x 45mm |
Sockets supported | FCLGA2011 | FCLGA1366 |
Thermal Design Power (TDP) | 115 Watt | 60 Watt |
Peripherals |
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Max number of PCIe lanes | 40 | |
PCI Express revision | 3.0 | |
Scalability | 2S Only | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Idle States | ||
Instruction set extensions | Intel® AVX | |
Intel 64 | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Flex Memory Access | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Physical Address Extensions (PAE) | 40-bit | |
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) |