Intel Xeon E5-2680 v2 vs Intel Xeon E3-1275

Comparative analysis of Intel Xeon E5-2680 v2 and Intel Xeon E3-1275 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, 3DMark Fire Strike - Physics Score, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).

Intel Xeon E5-2680 v2

Intel Xeon E3-1275

Differences

Reasons to consider the Intel Xeon E5-2680 v2

CPU is newer: launch date 2 year(s) 5 month(s) later
6 more cores, run more applications at once: 10 vs 4
12 more threads: 20 vs 8
Around 13% higher maximum core temperature: 82°C vs 72.6°C
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 32 nm
2.5x more L1 cache, more data can be stored in the L1 cache for quick access later
2.5x more L2 cache, more data can be stored in the L2 cache for quick access later
3.1x more L3 cache, more data can be stored in the L3 cache for quick access later
24x more maximum memory size: 768 GB vs 32 GB
Around 1% better performance in PassMark - Single thread mark: 1785 vs 1773
3.8x better performance in PassMark - CPU mark: 21232 vs 5516

Specifications (specs)
Launch date	September 2013 vs April 2011
Number of cores	10 vs 4
Number of threads	20 vs 8
Maximum core temperature	82°C vs 72.6°C
Manufacturing process technology	22 nm vs 32 nm
L1 cache	64 KB (per core) vs 64 KB (per core)
L2 cache	256 KB (per core) vs 256 KB (per core)
L3 cache	25600 KB (shared) vs 8192 KB (shared)
Maximum memory size	768 GB vs 32 GB
Max number of CPUs in a configuration	2 vs 1
Benchmarks
PassMark - Single thread mark	1785 vs 1773
PassMark - CPU mark	21232 vs 5516

Reasons to consider the Intel Xeon E3-1275

Around 6% higher clock speed: 3.80 GHz vs 3.60 GHz
Around 21% lower typical power consumption: 95 Watt vs 115 Watt

Maximum frequency	3.80 GHz vs 3.60 GHz
Thermal Design Power (TDP)	95 Watt vs 115 Watt

Compare benchmarks

CPU 1: Intel Xeon E5-2680 v2
CPU 2: Intel Xeon E3-1275

PassMark - Single thread mark

CPU 1

CPU 2

1785

1773

PassMark - CPU mark

CPU 1

CPU 2

21232

5516

Name	Intel Xeon E5-2680 v2	Intel Xeon E3-1275
PassMark - Single thread mark	1785	1773
PassMark - CPU mark	21232	5516
Geekbench 4 - Single Core	660
Geekbench 4 - Multi-Core	6091
3DMark Fire Strike - Physics Score	14639
CompuBench 1.5 Desktop - Face Detection (mPixels/s)	9.188
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s)	68.859
CompuBench 1.5 Desktop - T-Rex (Frames/s)	1.033
CompuBench 1.5 Desktop - Video Composition (Frames/s)	6.075
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s)	18.09

Compare specifications (specs)

	Intel Xeon E5-2680 v2	Intel Xeon E3-1275
Essentials
Architecture codename	Ivy Bridge EP	Sandy Bridge
Launch date	September 2013	April 2011
Launch price (MSRP)	$1,260	$450
Place in performance rating	1412	1414
Price now	$401.11	$304
Processor Number	E5-2680V2	E3-1275
Series	Intel® Xeon® Processor E5 v2 Family	Intel® Xeon® Processor E3 Family
Status	Launched	Discontinued
Value for money (0-100)	11.60	8.09
Vertical segment	Server	Server
Performance
64 bit support
Base frequency	2.80 GHz	3.40 GHz
Bus Speed	8 GT/s QPI	5 GT/s DMI
Die size	160 mm	216 mm
L1 cache	64 KB (per core)	64 KB (per core)
L2 cache	256 KB (per core)	256 KB (per core)
L3 cache	25600 KB (shared)	8192 KB (shared)
Manufacturing process technology	22 nm	32 nm
Maximum core temperature	82°C	72.6°C
Maximum frequency	3.60 GHz	3.80 GHz
Number of cores	10	4
Number of QPI Links	2
Number of threads	20	8
Transistor count	1400 million	1160 million
VID voltage range	0.65–1.30V
Memory
ECC memory support
Max memory channels	4	2
Maximum memory bandwidth	59.7 GB/s	21 GB/s
Maximum memory size	768 GB	32 GB
Supported memory types	DDR3 800/1066/1333/1600/1866	DDR3 1066/1333
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	2	1
Package Size	52.5mm x 45mm	37.5mm x 37.5mm
Sockets supported	FCLGA2011	LGA1155
Thermal Design Power (TDP)	115 Watt	95 Watt
Peripherals
Max number of PCIe lanes	40	20
PCI Express revision	3.0	2.0
PCIe configurations	x4, x8, x16
Scalability	2S Only
Security & Reliability
Execute Disable Bit (EDB)
Intel® Identity Protection technology
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® AVX	Intel® SSE4.1, Intel® SSE4.2, Intel® AVX
Intel 64
Intel® Advanced Vector Extensions (AVX)
Intel® AES New Instructions
Intel® Demand Based Switching
Intel® Flex Memory Access
Intel® Hyper-Threading technology
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® vPro™ Platform Eligibility
Physical Address Extensions (PAE)	46-bit
Thermal Monitoring
Flexible Display interface (FDI)
Intel® Fast Memory Access
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)
Graphics
Graphics base frequency		850 MHz
Graphics max dynamic frequency		1.35 GHz
Graphics max frequency		1.35 GHz
Intel® Clear Video HD technology
Intel® Flexible Display Interface (Intel® FDI)
Intel® InTru™ 3D technology
Intel® Quick Sync Video
Processor graphics		Intel HD Graphics P3000
Graphics interfaces
Number of displays supported		2
Wireless Display (WiDi) support