Intel Xeon E7-4880 v2 vs Intel Core 2 Duo SU9300

Comparative analysis of Intel Xeon E7-4880 v2 and Intel Core 2 Duo SU9300 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.

Intel Xeon E7-4880 v2

Intel Core 2 Duo SU9300

Differences

Reasons to consider the Intel Xeon E7-4880 v2

13 more cores, run more applications at once: 15 vs 2
28 more threads: 30 vs 2
Around 158% higher clock speed: 3.10 GHz vs 1.2 GHz
A newer manufacturing process allows for a more powerful, yet cooler running processor: 22 nm vs 45 nm

Number of cores	15 vs 2
Number of threads	30 vs 2
Maximum frequency	3.10 GHz vs 1.2 GHz
Manufacturing process technology	22 nm vs 45 nm

Reasons to consider the Intel Core 2 Duo SU9300

Around 44% higher maximum core temperature: 105°C vs 73°C
13x lower typical power consumption: 10 Watt vs 130 Watt

Maximum core temperature	105°C vs 73°C
Thermal Design Power (TDP)	10 Watt vs 130 Watt

Compare benchmarks

CPU 1: Intel Xeon E7-4880 v2
CPU 2: Intel Core 2 Duo SU9300

Name	Intel Xeon E7-4880 v2	Intel Core 2 Duo SU9300
PassMark - Single thread mark	1493
PassMark - CPU mark	38263
Geekbench 4 - Single Core		874
Geekbench 4 - Multi-Core		1435

Compare specifications (specs)

	Intel Xeon E7-4880 v2	Intel Core 2 Duo SU9300
Essentials
Architecture codename	Ivy Bridge	Penryn
Launch date	Q1'14	20 August 2008
Place in performance rating	1078	2349
Processor Number	E7-4880V2	SU9300
Series	Intel® Xeon® Processor E7 v2 Family	Legacy Intel® Core™ Processors
Status	Launched	Discontinued
Vertical segment	Server	Mobile
Performance
64 bit support
Base frequency	2.50 GHz	1.20 GHz
Bus Speed	8 GT/s QPI	800 MHz FSB
Manufacturing process technology	22 nm	45 nm
Maximum core temperature	73°C	105°C
Maximum frequency	3.10 GHz	1.2 GHz
Number of cores	15	2
Number of QPI Links	3
Number of threads	30	2
Die size		107 mm2
Front-side bus (FSB)		800 MHz
L2 cache		3072 KB
Transistor count		410 million
VID voltage range		1.050V-1.150V
Memory
Max memory channels	4
Maximum memory bandwidth	85 GB/s
Maximum memory size	1.5 TB
Supported memory types	DDR3 1066/1333/1600
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	4
Package Size	52mm x 45mm	22mm x 22mm
Sockets supported	FCLGA2011	BGA956
Thermal Design Power (TDP)	130 Watt	10 Watt
Peripherals
Max number of PCIe lanes	32
PCI Express revision	3.0
PCIe configurations	x4, x8, x16
Scalability	S4S
Security & Reliability
Execute Disable Bit (EDB)
Intel® OS Guard
Intel® Secure Key technology
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Idle States
Instruction set extensions	Intel® AVX
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Instruction Replay Technology
Intel® TSX-NI
Intel® Turbo Boost technology
Physical Address Extensions (PAE)	46-bit
Thermal Monitoring
FSB parity
Intel® Demand Based Switching
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)