Intel Xeon E7540 vs Intel Xeon E3-1270
Comparative analysis of Intel Xeon E7540 and Intel Xeon E3-1270 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory, Graphics, Graphics interfaces, Peripherals. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, Geekbench 4 - Single Core, Geekbench 4 - Multi-Core, CompuBench 1.5 Desktop - Face Detection (mPixels/s), CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s), CompuBench 1.5 Desktop - T-Rex (Frames/s), CompuBench 1.5 Desktop - Video Composition (Frames/s), CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s).
Differences
Reasons to consider the Intel Xeon E7540
- 2 more cores, run more applications at once: 6 vs 4
- 4 more threads: 12 vs 8
- Around 75% better performance in PassMark - CPU mark: 9409 vs 5376
Specifications (specs) | |
Number of cores | 6 vs 4 |
Number of threads | 12 vs 8 |
Benchmarks | |
PassMark - CPU mark | 9409 vs 5376 |
Reasons to consider the Intel Xeon E3-1270
- Around 67% higher clock speed: 3.80 GHz vs 2.27 GHz
- Around 8% higher maximum core temperature: 69.1°C vs 64°C
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 32 nm vs 45 nm
- 466033.8x more L3 cache, more data can be stored in the L3 cache for quick access later
- Around 31% lower typical power consumption: 80 Watt vs 105 Watt
- Around 92% better performance in PassMark - Single thread mark: 1750 vs 911
Specifications (specs) | |
Maximum frequency | 3.80 GHz vs 2.27 GHz |
Maximum core temperature | 69.1°C vs 64°C |
Manufacturing process technology | 32 nm vs 45 nm |
L3 cache | 8192 KB (shared) vs 18 MB L3 Cache |
Thermal Design Power (TDP) | 80 Watt vs 105 Watt |
Benchmarks | |
PassMark - Single thread mark | 1750 vs 911 |
Compare benchmarks
CPU 1: Intel Xeon E7540
CPU 2: Intel Xeon E3-1270
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon E7540 | Intel Xeon E3-1270 |
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PassMark - Single thread mark | 911 | 1750 |
PassMark - CPU mark | 9409 | 5376 |
Geekbench 4 - Single Core | 738 | |
Geekbench 4 - Multi-Core | 2830 | |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 12.187 | |
CompuBench 1.5 Desktop - Ocean Surface Simulation (Frames/s) | 79.092 | |
CompuBench 1.5 Desktop - T-Rex (Frames/s) | 0.558 | |
CompuBench 1.5 Desktop - Video Composition (Frames/s) | 3.622 | |
CompuBench 1.5 Desktop - Bitcoin Mining (mHash/s) | 15.794 |
Compare specifications (specs)
Intel Xeon E7540 | Intel Xeon E3-1270 | |
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Essentials |
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Architecture codename | Nehalem EX | Sandy Bridge |
Launch date | Q1'10 | April 2011 |
Place in performance rating | 2098 | 2105 |
Processor Number | E7540 | E3-1270 |
Series | Legacy Intel Xeon Processors | Intel® Xeon® Processor E3 Family |
Vertical segment | Server | Server |
Launch price (MSRP) | $369 | |
Price now | $317 | |
Status | Discontinued | |
Value for money (0-100) | 7.66 | |
Performance |
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Base frequency | 2.00 GHz | 3.40 GHz |
Bus Speed | 6.4 GT/s | 5 GT/s DMI |
L3 cache | 18 MB L3 Cache | 8192 KB (shared) |
Manufacturing process technology | 45 nm | 32 nm |
Maximum core temperature | 64°C | 69.1°C |
Maximum frequency | 2.27 GHz | 3.80 GHz |
Number of cores | 6 | 4 |
Number of threads | 12 | 8 |
64 bit support | ||
Die size | 216 mm | |
L1 cache | 64 KB (per core) | |
L2 cache | 256 KB (per core) | |
Transistor count | 1160 million | |
Compatibility |
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Sockets supported | FCLGA1567 | LGA1155 |
Thermal Design Power (TDP) | 105 Watt | 80 Watt |
Low Halogen Options Available | ||
Max number of CPUs in a configuration | 1 | |
Package Size | 37.5mm x 37.5mm | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Identity Protection technology | ||
Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Intel 64 | ||
Intel® Hyper-Threading technology | ||
Intel® Turbo Boost technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Instruction set extensions | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX | |
Intel® Advanced Vector Extensions (AVX) | ||
Intel® AES New Instructions | ||
Intel® Demand Based Switching | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® vPro™ Platform Eligibility | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Memory |
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ECC memory support | ||
Max memory channels | 2 | |
Maximum memory bandwidth | 21 GB/s | |
Maximum memory size | 32 GB | |
Supported memory types | DDR3 1066/1333 | |
Graphics |
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Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Graphics interfaces |
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Wireless Display (WiDi) support | ||
Peripherals |
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Max number of PCIe lanes | 20 | |
PCI Express revision | 2.0 |