Intel Xeon Gold 6150 vs Intel Xeon E3-1285 v3
Comparative analysis of Intel Xeon Gold 6150 and Intel Xeon E3-1285 v3 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization, Graphics, Graphics interfaces. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark, CompuBench 1.5 Desktop - Face Detection (mPixels/s), Geekbench 4 - Single Core, Geekbench 4 - Multi-Core.
Differences
Reasons to consider the Intel Xeon Gold 6150
- 14 more cores, run more applications at once: 18 vs 4
- 28 more threads: 36 vs 8
- A newer manufacturing process allows for a more powerful, yet cooler running processor: 14 nm vs 22 nm
- 24x more maximum memory size: 768 GB vs 32 GB
- 6.8x better performance in PassMark - CPU mark: 47300 vs 6974
Specifications (specs) | |
Number of cores | 18 vs 4 |
Number of threads | 36 vs 8 |
Manufacturing process technology | 14 nm vs 22 nm |
Maximum memory size | 768 GB vs 32 GB |
Benchmarks | |
PassMark - CPU mark | 47300 vs 6974 |
Reasons to consider the Intel Xeon E3-1285 v3
- Around 8% higher clock speed: 4.00 GHz vs 3.70 GHz
- Around 96% lower typical power consumption: 84 Watt vs 165 Watt
- Around 5% better performance in PassMark - Single thread mark: 2213 vs 2115
Specifications (specs) | |
Maximum frequency | 4.00 GHz vs 3.70 GHz |
Thermal Design Power (TDP) | 84 Watt vs 165 Watt |
Benchmarks | |
PassMark - Single thread mark | 2213 vs 2115 |
Compare benchmarks
CPU 1: Intel Xeon Gold 6150
CPU 2: Intel Xeon E3-1285 v3
PassMark - Single thread mark |
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PassMark - CPU mark |
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Name | Intel Xeon Gold 6150 | Intel Xeon E3-1285 v3 |
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PassMark - Single thread mark | 2115 | 2213 |
PassMark - CPU mark | 47300 | 6974 |
CompuBench 1.5 Desktop - Face Detection (mPixels/s) | 18.535 | |
Geekbench 4 - Single Core | 4234 | |
Geekbench 4 - Multi-Core | 13074 |
Compare specifications (specs)
Intel Xeon Gold 6150 | Intel Xeon E3-1285 v3 | |
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Essentials |
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Architecture codename | Skylake | Haswell |
Launch date | Q3'17 | June 2013 |
Place in performance rating | 597 | 600 |
Processor Number | 6150 | E3-1285 v3 |
Series | Intel® Xeon® Scalable Processors | Intel® Xeon® Processor E3 v3 Family |
Status | Launched | Discontinued |
Vertical segment | Server | Server |
Performance |
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Base frequency | 2.70 GHz | 3.60 GHz |
Manufacturing process technology | 14 nm | 22 nm |
Maximum core temperature | 89°C | |
Maximum frequency | 3.70 GHz | 4.00 GHz |
Number of cores | 18 | 4 |
Number of threads | 36 | 8 |
Number of Ultra Path Interconnect (UPI) Links | 3 | |
64 bit support | ||
Bus Speed | 5 GT/s DMI | |
Die size | 160 mm | |
L1 cache | 64 KB (per core) | |
L2 cache | 256 KB (per core) | |
L3 cache | 8192 KB (shared) | |
Number of QPI Links | 0 | |
Transistor count | 1400 million | |
Memory |
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Max memory channels | 6 | 2 |
Maximum memory size | 768 GB | 32 GB |
Supported memory frequency | 2666 MHz | |
Supported memory types | DDR4-2666 | DDR3 and DDR3L 1333/1600 at 1.5V |
ECC memory support | ||
Maximum memory bandwidth | 25.6 GB/s | |
Compatibility |
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Low Halogen Options Available | ||
Package Size | 76.0mm x 56.5mm | 37.5mm x 37.5mm |
Sockets supported | FCLGA3647 | FCLGA1150 |
Thermal Design Power (TDP) | 165 Watt | 84 Watt |
Max number of CPUs in a configuration | 1 | |
Thermal Solution | PCG 2013D | |
Peripherals |
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Max number of PCIe lanes | 48 | 16 |
PCI Express revision | 3.0 | 3.0 |
Scalability | S4S | 1S Only |
PCIe configurations | 1x16, 2x8, 1x8/2x4 | |
Security & Reliability |
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Execute Disable Bit (EDB) | ||
Intel® Run Sure Technology | ||
Intel® Trusted Execution technology (TXT) | ||
Mode-based Execute Control (MBE) | ||
Anti-Theft technology | ||
Intel® Identity Protection technology | ||
Intel® OS Guard | ||
Intel® Secure Key technology | ||
Advanced Technologies |
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Enhanced Intel SpeedStep® technology | ||
Instruction set extensions | Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512 | Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2 |
Intel 64 | ||
Intel® AES New Instructions | ||
Intel® Hyper-Threading technology | ||
Intel® Optane™ Memory Supported | ||
Intel® TSX-NI | ||
Intel® Turbo Boost technology | ||
Intel® Volume Management Device (VMD) | ||
Intel® vPro™ Platform Eligibility | ||
Number of AVX-512 FMA Units | 2 | |
Speed Shift technology | ||
Flexible Display interface (FDI) | ||
Idle States | ||
Intel® Advanced Vector Extensions (AVX) | ||
Intel® Fast Memory Access | ||
Intel® Flex Memory Access | ||
Intel® Stable Image Platform Program (SIPP) | ||
Thermal Monitoring | ||
Virtualization |
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Intel® Virtualization Technology (VT-x) | ||
Intel® Virtualization Technology for Directed I/O (VT-d) | ||
Intel® VT-x with Extended Page Tables (EPT) | ||
Graphics |
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Graphics base frequency | 350 MHz | |
Graphics max dynamic frequency | 1.30 GHz | |
Graphics max frequency | 1.3 GHz | |
Intel® Clear Video HD technology | ||
Intel® Flexible Display Interface (Intel® FDI) | ||
Intel® InTru™ 3D technology | ||
Intel® Quick Sync Video | ||
Processor graphics | Intel HD Graphics P4700 | |
Graphics interfaces |
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Number of displays supported | 3 |