AMD EPYC 8124P vs Intel Xeon Gold 6150

Comparative analysis of AMD EPYC 8124P and Intel Xeon Gold 6150 processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization. Benchmark processor performance analysis: PassMark - Single thread mark, PassMark - CPU mark.

AMD EPYC 8124P

Intel Xeon Gold 6150

Differences

Reasons to consider the AMD EPYC 8124P

A newer manufacturing process allows for a more powerful, yet cooler running processor: 5 nm vs 14 nm
Around 32% lower typical power consumption: 125 Watt vs 165 Watt
Around 11% better performance in PassMark - Single thread mark: 2338 vs 2115

Specifications (specs)
Manufacturing process technology	5 nm vs 14 nm
Thermal Design Power (TDP)	125 Watt vs 165 Watt
Benchmarks
PassMark - Single thread mark	2338 vs 2115

Reasons to consider the Intel Xeon Gold 6150

2 more cores, run more applications at once: 18 vs 16
4 more threads: 36 vs 32
Around 23% higher clock speed: 3.70 GHz vs 3 GHz
Around 30% better performance in PassMark - CPU mark: 47300 vs 36338

Specifications (specs)
Number of cores	18 vs 16
Number of threads	36 vs 32
Maximum frequency	3.70 GHz vs 3 GHz
Benchmarks
PassMark - CPU mark	47300 vs 36338

Compare benchmarks

CPU 1: AMD EPYC 8124P
CPU 2: Intel Xeon Gold 6150

PassMark - Single thread mark

CPU 1

CPU 2

2338

2115

PassMark - CPU mark

CPU 1

CPU 2

36338

47300

Name	AMD EPYC 8124P	Intel Xeon Gold 6150
PassMark - Single thread mark	2338	2115
PassMark - CPU mark	36338	47300

Compare specifications (specs)

	AMD EPYC 8124P	Intel Xeon Gold 6150
Essentials
Launch date	18 Sep 2023	Q3'17
Launch price (MSRP)	$639
Place in performance rating	645	597
Architecture codename		Skylake
Processor Number		6150
Series		Intel® Xeon® Scalable Processors
Status		Launched
Vertical segment		Server
Performance
Base frequency	2.45 GHz	2.70 GHz
Die size	2x 73 mm²
L1 cache	64 KB (per core)
L2 cache	1 MB (per core)
L3 cache	64 MB (shared)
Manufacturing process technology	5 nm	14 nm
Maximum case temperature (TCase)	75°C
Maximum frequency	3 GHz	3.70 GHz
Number of cores	16	18
Number of threads	32	36
Transistor count	17,750 million
Unlocked
Maximum core temperature		89°C
Number of Ultra Path Interconnect (UPI) Links		3
Memory
ECC memory support
Supported memory types	DDR5	DDR4-2666
Max memory channels		6
Maximum memory size		768 GB
Supported memory frequency		2666 MHz
Compatibility
Configurable TDP	120-150 Watt
Max number of CPUs in a configuration	1
Sockets supported	SP6	FCLGA3647
Thermal Design Power (TDP)	125 Watt	165 Watt
Low Halogen Options Available
Package Size		76.0mm x 56.5mm
Peripherals
PCIe configurations	Gen 5, 96 Lanes, (CPU only)
Max number of PCIe lanes		48
PCI Express revision		3.0
Scalability		S4S
Security & Reliability
Execute Disable Bit (EDB)
Intel® Run Sure Technology
Intel® Trusted Execution technology (TXT)
Mode-based Execute Control (MBE)
Advanced Technologies
Enhanced Intel SpeedStep® technology
Instruction set extensions		Intel® SSE4.2, Intel® AVX, Intel® AVX2, Intel® AVX-512
Intel 64
Intel® AES New Instructions
Intel® Hyper-Threading technology
Intel® Optane™ Memory Supported
Intel® TSX-NI
Intel® Turbo Boost technology
Intel® Volume Management Device (VMD)
Intel® vPro™ Platform Eligibility
Number of AVX-512 FMA Units		2
Speed Shift technology
Virtualization
Intel® Virtualization Technology (VT-x)
Intel® Virtualization Technology for Directed I/O (VT-d)
Intel® VT-x with Extended Page Tables (EPT)