Intel Xeon MP 7040 Dual-Core vs Intel Pentium 4 HT 662

Comparative analysis of Intel Xeon MP 7040 Dual-Core and Intel Pentium 4 HT 662 processors for all known characteristics in the following categories: Essentials, Performance, Compatibility, Security & Reliability, Advanced Technologies, Virtualization, Memory.

Intel Xeon MP 7040 Dual-Core

Intel Pentium 4 HT 662

Differences

Reasons to consider the Intel Xeon MP 7040 Dual-Core

CPU is newer: launch date 0 month(s) later
1 more cores, run more applications at once: 2 vs 1
Around 7% higher maximum core temperature: 76°C vs 70.8°C

Launch date	December 2005 vs November 2005
Number of cores	2 vs 1
Maximum core temperature	76°C vs 70.8°C
Max number of CPUs in a configuration	2 vs 1

Reasons to consider the Intel Pentium 4 HT 662

Around 20% higher clock speed: 3.6 GHz vs 3 GHz
Around 75% more L1 cache; more data can be stored in the L1 cache for quick access later
2x more L2 cache, more data can be stored in the L2 cache for quick access later
Around 43% lower typical power consumption: 115 Watt vs 165 Watt

Maximum frequency	3.6 GHz vs 3 GHz
L1 cache	28 KB vs 16 KB
L2 cache	2048 KB vs 1024 KB
Thermal Design Power (TDP)	115 Watt vs 165 Watt

Compare specifications (specs)

	Intel Xeon MP 7040 Dual-Core	Intel Pentium 4 HT 662
Essentials
Architecture codename	Paxville	Prescott
Launch date	December 2005	November 2005
Place in performance rating	not rated	not rated
Processor Number	7040	662
Series	Legacy Intel® Xeon® Processors	Legacy Intel® Pentium® Processor
Status	Discontinued	Discontinued
Vertical segment	Server	Desktop
Performance
64 bit support
Base frequency	3.00 GHz	3.60 GHz
Bus Speed	667 MHz FSB	800 MHz FSB
Die size	206 mm2	135 mm2
L1 cache	16 KB	28 KB
L2 cache	1024 KB	2048 KB
Manufacturing process technology	90 nm	90 nm
Maximum core temperature	76°C	70.8°C
Maximum frequency	3 GHz	3.6 GHz
Number of cores	2	1
Transistor count	230 million	169 million
VID voltage range	1.2625V-1.4125V	1.200V-1.400V
Compatibility
Low Halogen Options Available
Max number of CPUs in a configuration	2	1
Package Size	53.3mm x 53.3mm	37.5mm x 37.5mm
Sockets supported	PPGA604	PLGA775
Thermal Design Power (TDP)	165 Watt	115 Watt
Security & Reliability
Execute Disable Bit (EDB)
Intel® Trusted Execution technology (TXT)
Advanced Technologies
Enhanced Intel SpeedStep® technology
FSB parity
Idle States
Intel 64
Intel® Demand Based Switching
Intel® Hyper-Threading technology
Intel® Turbo Boost technology
Physical Address Extensions (PAE)	32-bit
Thermal Monitoring
Virtualization
Intel® Virtualization Technology (VT-x)
Memory
Supported memory types		DDR1, DDR2, DDR3