Intel Xeon Phi 5110P vs Intel Xeon Phi 7110P
Comparative analysis of Intel Xeon Phi 5110P and Intel Xeon Phi 7110P processors for all known characteristics in the following categories: Essentials, Performance, Memory, Compatibility, Peripherals, Security & Reliability, Advanced Technologies, Virtualization.
Differences
Reasons to consider the Intel Xeon Phi 5110P
- Around 33% lower typical power consumption: 225 Watt vs 300 Watt
| Thermal Design Power (TDP) | 225 Watt vs 300 Watt |
Reasons to consider the Intel Xeon Phi 7110P
- 1 more cores, run more applications at once: 61 vs 60
- Around 19% higher clock speed: 1.25 GHz vs 1.05 GHz
- Around 2% more L1 cache; more data can be stored in the L1 cache for quick access later
- Around 2% more L2 cache; more data can be stored in the L2 cache for quick access later
| Number of cores | 61 vs 60 |
| Maximum frequency | 1.25 GHz vs 1.05 GHz |
| L1 cache | 32 KB (per core) vs 32 KB (per core) |
| L2 cache | 512 KB (per core) vs 512 KB (per core) |
Compare specifications (specs)
| Intel Xeon Phi 5110P | Intel Xeon Phi 7110P | |
|---|---|---|
Essentials |
||
| Architecture codename | Knights Corner | Knights Corner |
| Launch date | November 2012 | November 2012 |
| Place in performance rating | not rated | not rated |
| Processor Number | 5110P | |
| Series | Intel® Xeon Phi™ x100 Product Family | |
| Status | Discontinued | |
| Vertical segment | Server | Server |
Performance |
||
| 64 bit support | ||
| Base frequency | 1.05 GHz | |
| Die size | 350 mm | 350 mm |
| L1 cache | 32 KB (per core) | 32 KB (per core) |
| L2 cache | 512 KB (per core) | 512 KB (per core) |
| Manufacturing process technology | 22 nm | 22 nm |
| Maximum frequency | 1.05 GHz | 1.25 GHz |
| Number of cores | 60 | 61 |
| Transistor count | 5000 million | 5000 million |
Memory |
||
| Max memory channels | 16 | |
| Maximum memory bandwidth | 320 GB/s | |
| Maximum memory size | 8 GB | |
| Supported memory types | DDR3, DDR4 | DDR3, DDR4 |
Compatibility |
||
| Low Halogen Options Available | ||
| Max number of CPUs in a configuration | 1 | 1 |
| Thermal Design Power (TDP) | 225 Watt | 300 Watt |
Peripherals |
||
| PCI Express revision | 2.0 | |
Security & Reliability |
||
| Intel® Trusted Execution technology (TXT) | ||
Advanced Technologies |
||
| Instruction set extensions | Intel® IMCI | |
| Intel® Advanced Vector Extensions (AVX) | ||
| Intel® AES New Instructions | ||
| Intel® Turbo Boost technology | ||
| Intel® vPro™ Platform Eligibility | ||
Virtualization |
||
| Intel® Virtualization Technology (VT-x) | ||
| Intel® Virtualization Technology for Directed I/O (VT-d) | ||